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Electronics and Packaging
1681-1070
2008 Issue 1
The Resplendent 50 Years——Memorializing for the 50 Years of IC Invention
YU Zong-guang
..............
page:1-4
Metallographic Analysis of Glass to Metal Sealing Technics
XU Yu-wen;ZHANG Zheng-jun
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page:5-8,32
Precise Seam Weld Technology Research for Microelectronics Metal Devices
ZHANG Xue-qin
..............
page:9-11
xin nian he ci
..............
page:插1
xin xi bao dao
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page:4,11,36,48
Tools, Technologies and the Processes of Web Engineering(2)
PEI Yan-lan
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page:44-48
Brief Study on Industry and Research Strategy of Weapon Equipment in U.S.A
CAO Chang-de
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page:40-43
Signal Preprocessing System for Geomagnetic Field Measurement
HUANG Su-fang;QIN Hui-bin
..............
page:37-39,48
Wet Chemical Concentration Control in Semiconductor Industry
ZhANG Zheng-rong;WANG Hui
..............
page:33-36
Research on High Performance Full Adder
ZHOU De-jin;SUN Feng;YU Zong-guang
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page:29-32
A Sub-threshold Operation CMOS Voltage Reference Design Based on New Biased Circuit
CAI Li-da;CHANG Chang-yuan
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page:25-28
A CMOS VGA Gain Exponential-changed Control Circuit Design
ZHOU Xu-dong;ZHOU Ye;YANG Gong-cheng
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page:21-24,36
Recent Advances of Flip-Chip Underfill Process(1)
GUO Da-qi;HUANG Qiang
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page:16-20
Discussion about LED Lamp Forward Voltage VF Failure
SI Fang-hu
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page:12-15