Electronics and Packaging 2007 Issue 9 xin xi bao dao

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Electronics and Packaging
1681-1070
2007 Issue 9

xin xi bao dao

..............page:3,11,39,43-46

Analasys Principal Factors and Aftereffect of Influence Good Quality in PIP
MU Shu-xian;SHI Qi-jun

..............page:40-42

Implementation of the 4k Point Radix-16 FFT Module Based on FPGA
SU Yan-peng;ZHANG Han-fu;HAN Lei

..............page:8-11

A New Design for Peak-power BIST
LIU Jian-jun;LIU Wei;KANG Yue-ming

..............page:4-7,33

Analysis and Research Results of Wafer Probing on Abnormal Problem
LUO Shi-kai;WANG Hui

..............page:1-3

Analysis and Research on Leak Rate Equations,Failure Criteria and Internal Gas Concentration(1)
WANG Geng-lin;WANG Li-yan;DONG Li-jun

..............page:34-39

Negative-bias Temperature Instability Cure by Process Optimization
REN Jia-dong;WANG Hui;LU Feng

..............page:30-33

Analysis of Plasma Damage-induced EEPROM Failures
XIAO Chun-ye;XU Zheng

..............page:26-29

Study on Integrating CMOS Compatible High-voltage MOSFETs in a 0.5μm Process
LIU Yun;ZHAO Wen-bin

..............page:22-25

The Serial Commucation Design of TMS320F240 DSP Controller
XU Xin-yu;ZHANG Meng-hua

..............page:19-21,29

Charge Pump Design for PLL Synthesizer
XUE Hong;LI Zhi-qun;WANG Zhi-gong

..............page:15-18

The Design of Wallace Tree by Using a Structure of Modified Mixed Compression
SHAO Lei;ZHANG Shu-dan;YU Zong-guang

..............page:12-14,18