Electronics and Packaging 2007 Issue 7 The Summarizing of SAW Packaging Technology

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Electronics and Packaging
1681-1070
2007 Issue 7

The Summarizing of SAW Packaging Technology
YANG Yuan-hua;WANG Bao-wei

..............page:1-4,9

Investigation on Zmbedded Inductor in LTCC
YANG Zong-bao;LIU Yin-li;YAN Wen-qin;LI Yuan-xun

..............page:5-9

Study of I2C Bus Controlled Audio Circuit Test Method
DU Yuan-xun;ZHOU Ya-li;TAO Xue-feng

..............page:10-13

Microstrip to Stripline Vertical Transition with LTCC Technology
ZHOU Jun;SHEN Ya;DAI Lei;WANG Zi-liang;LI Fu-xiao

..............page:14-16,23

..............page:17-20,48

Analysis of the DDS Output Spurs and Reduction Technique
LI Kun;ZHANG Han-fu;ZHANG Shu-dan;YU Zong-guang

..............page:21-23

Design of SoC Debug System Based on JTAG
YU Zhi-guo;WEI Jing-he

..............page:24-27,48

Process ＆ Application of SIPOS
yu cheng ; li jian li ; wu dan ; ji peng cheng ; liu wen long ; huang qiang

..............page:28-31

The Actuality and Development Directions of FPGA
WANG Hong;PENG Liang;YU Zong-guang

..............page:32-37

Application of Hall Sensor on Electric Leaf Folding Doors
CUI Jia-dong;LUO You;QIN Hui-bin

..............page:38-40

The SOI Devices and Applications
LUO Hao-ping

..............page:41-45

xin xi bao dao

..............page:31,37,46-48

..............page:插1