Electronics and Packaging 2007 Issue 6 zhua zhu " shi yi wu " ji yu da li tui jin wo guo ban dao ti xian jin feng zhuang ce shi ye de fa zhan zhong guo ban dao ti feng zhuang ce shi ji shu yu shi chang yan tao hui kai mu ci

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Electronics and Packaging
1681-1070
2007 Issue 6

..............page:1,7

Introduction of Embedded Ethernet Microprocessor
SONG Ming;WANG Hui;WANG Run-chun

..............page:2-7

..............page:8-12,48

Design of Pads on Ceramic Package IC Chip
WANG Yang;HUA Chen;GUO Da-qi

..............page:13-17

Technology of Many Gold Studs for Flip-Chip
GUO Hui;GUO Da-qi

..............page:18-20

Design of a New Sense Amplifier Structure
GAO Ning;SHI Liang;YU Zong-guan

..............page:21-24

..............page:25-27

Design for 8 GHz ～ 12 GHz Push-Push VCO
MA Jian-jun;ZHU Hong;WANG Hong-mei

..............page:28-30

Design of a Peak-current-mode Pulse Width Modulator
LI Hui;WANG Ji-an;CAI Hua;GONG Min

..............page:31-34

Radiating Technology of Power Electronics
ZHANG Xue-fen;CHEN Xu

..............page:35-39,48

The Split of Reference Plane
JIN Wei;WEI Li-li;WANG Li

..............page:40-43

xin xi bao dao

..............page:7,44-48

..............page:插1