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Electronics and Packaging
1681-1070
2007 Issue 5
Static-Noise Margin Analysis on DSM SRAM Cell
SHI Liang;GAO Ning;YU Zong-guang
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page:22-24
Potting Process Design of Outdoor LED Display Module
LI Yan;SHEN Feng
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page:19-21
Packaging and Disassemble Technology of Irregular Shapes Module of Microwave MCM
CHEN Qi-hai;HU Jun;CHENG Ming-sheng;DING Fei
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page:16-18,21
AutoVue Software Should be Used for SMT Production
XIAN Fei
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page:12-15
Properties of AlSiC Electronic Packaging Composites Fabricated by P/M Technology
WANG Xiao-yang;ZHU Li-juan;LIU Yue
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page:9-11,15
A Wafer Level Package——Ultra CSPTM
YANG Jian-sheng
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page:4-8
SiP and PoP
WENG Shou-song
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page:1-3
Design of the Prototyping Method Based on FPGA for ARM7TDMI Embedded SoC Verification
YU Zhi-guo;WEI Jing-he
..............
page:25-28
A Fast MVR-CORDIC Algorithms Based Lattice IIR Filter
HOU Wei-hua;ZHANG Ling;LIU Ming-feng;YU Zong-guang
..............
page:29-32
The Control Problem of the Room Pressure Value in Cleanroom
JIANG Mao;PAN Guo-hua;WANG Tie-kun
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page:33-37
In EMI the Choice and Applied Study of Common Use Electronics Component
DU Ying;ZHANG Jian
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page:38-41,48
atmi: ban dao ti zhi cheng xiao lv zhi yuan fang atmi ya zhou qu zong jing li yang zhi hai xian sheng
chen ai si
..............
page:42-43
xin xi bao dao
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page:8,37,43-48