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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2007 Issue 5
Static-Noise Margin Analysis on DSM SRAM Cell
SHI Liang;GAO Ning;YU Zong-guang
..............page:22-24
Potting Process Design of Outdoor LED Display Module
LI Yan;SHEN Feng
..............page:19-21
Packaging and Disassemble Technology of Irregular Shapes Module of Microwave MCM
CHEN Qi-hai;HU Jun;CHENG Ming-sheng;DING Fei
..............page:16-18,21
AutoVue Software Should be Used for SMT Production
XIAN Fei
..............page:12-15
Properties of AlSiC Electronic Packaging Composites Fabricated by P/M Technology
WANG Xiao-yang;ZHU Li-juan;LIU Yue
..............page:9-11,15
A Wafer Level Package——Ultra CSPTM
YANG Jian-sheng
..............page:4-8
SiP and PoP
WENG Shou-song
..............page:1-3
A Fast MVR-CORDIC Algorithms Based Lattice IIR Filter
HOU Wei-hua;ZHANG Ling;LIU Ming-feng;YU Zong-guang
..............page:29-32
The Control Problem of the Room Pressure Value in Cleanroom
JIANG Mao;PAN Guo-hua;WANG Tie-kun
..............page:33-37
In EMI the Choice and Applied Study of Common Use Electronics Component
DU Ying;ZHANG Jian
..............page:38-41,48
xin xi bao dao
..............page:8,37,43-48