1681-1070
2007 Issue 3
The Material, Technology and some Questions on the Encapsulation in Current Epoxy Resin
HUANG Dao-sheng
HUANG Dao-sheng
..............page:1-3,19
Study on the Reliability of Sn-Ag-Cu Lead-free Solders
HAN Yong-dian;JING Hong-yang;XU Lian-yong;GUO Wei-jie;WANG Zhong-xing
HAN Yong-dian;JING Hong-yang;XU Lian-yong;GUO Wei-jie;WANG Zhong-xing
..............page:4-6,33
The Feasibility of Simultaneously Transfer Molding the Underfill and Overmold of Flip Chip
LIU Hong-jun
LIU Hong-jun
..............page:7-10,19
Present Status and Prospects of the Researches on the SiCp/Al Composite Materials for Electronic Packaging
TIAN Da-lei;WANG Xing;GUAN Rong-feng
TIAN Da-lei;WANG Xing;GUAN Rong-feng
..............page:11-15
Research of the High Luminosity and Purity White LED Encapsulation Technology
WANG Xiao-jun;HUANG Chun-ying;LIU Zhao-hui
WANG Xiao-jun;HUANG Chun-ying;LIU Zhao-hui
..............page:16-19
A Clock Management Circuit in High-Speed Pipeline ADC
ZHOU Xiao-kang;WANG Ji-an;PANG Shi-fu;LI Wei;GONG Min
ZHOU Xiao-kang;WANG Ji-an;PANG Shi-fu;LI Wei;GONG Min
..............page:20-23,37
Research on CMOS Latchup
NIU Zheng
NIU Zheng
..............page:24-27
The Study and Prospects of Heat Sink Technology about Semiconductor Lasers
CHENG Dong-ming;DU Yan-li;MA Feng-ying;DUAN Zhi-yong;GUO Mao-tian
CHENG Dong-ming;DU Yan-li;MA Feng-ying;DUAN Zhi-yong;GUO Mao-tian
..............page:28-33
..............page:34-37
Analyzes and Application of ADC Technology
JIANG Zhen
JIANG Zhen
..............page:38-42
..............page:27,43-46
..............page:后插1