1681-1070
2007 Issue 2
A Few New Packaging Technologies
WENG Shou-song
WENG Shou-song
..............page:1-3
..............page:4-6
Electronic Packaging Technology and Polymer-based Composite Packaging Materials
HE Hong;FU Ren-li;SHEN Yuan;HAN Yan-chun;SONG Xiu-feng
HE Hong;FU Ren-li;SHEN Yuan;HAN Yan-chun;SONG Xiu-feng
..............page:7-10
..............page:11-15
Characterization of Interface Strength as Function of Temperature and Moisture Conditions
W.D. van Driel;P.J.J.H.A. Habets;M.A.J. van Gils;G.Q. Zhang
W.D. van Driel;P.J.J.H.A. Habets;M.A.J. van Gils;G.Q. Zhang
..............page:16-22
A Six-order Noise Shaping Algorithm Used in ∑-△ ADC
PANG Shi-fu;WANG Ji-an;GONG Min;CAI Hua
PANG Shi-fu;WANG Ji-an;GONG Min;CAI Hua
..............page:23-26,37
0.5 μm CMOS 622 Mb·s-1 LVDS Driver Design
NIU Xiao-kang;LI Zhi-qun;XU Yong;WANG Huan
NIU Xiao-kang;LI Zhi-qun;XU Yong;WANG Huan
..............page:27-29,37
Multi-Objective Optimization Based SoC Hardware-software Partition
LU Yi;LUO Sheng-qin;WANG Chang-hui
LU Yi;LUO Sheng-qin;WANG Chang-hui
..............page:30-33,47
..............page:34-37
Temperature Characteristics of High Voltage PMOSFET with Standard CMOS Technology
LI Hong-zheng;ZHOU Chuan-miao;YU Zong-guang
LI Hong-zheng;ZHOU Chuan-miao;YU Zong-guang
..............page:38-40
The Application of AHP in Logistics Network Planning in the Environment of Communication
SUN Hong;GENG Lian
SUN Hong;GENG Lian
..............page:41-44
..............page:45-46
..............page:48