1681-1070
2007 Issue 11
..............page:插1
..............page:12
Analysis and Research on Leak Rate Equations, Failure Criteria and Internal Gas Concentration (3)
WANG Geng-lin;WANG Li-yan;DONG Li-jun
WANG Geng-lin;WANG Li-yan;DONG Li-jun
..............page:45-48
Research on NWELL Resistor SPICE Model of HV Process
LI Yue-ying;LI Bing;HE Xiao-dong
LI Yue-ying;LI Bing;HE Xiao-dong
..............page:39-44
The Co-evaporation Technology of Ohmic Contact in GaAs PHEMT
JIA Jie;ZHENG Hua;GENG Tao;HUANG Nian-ning
JIA Jie;ZHENG Hua;GENG Tao;HUANG Nian-ning
..............page:35-38
SOI Technology's Trouble & BSIM3SOIv1.3 Model Parameter's Characteristics
GU Ai-jun;SUN Feng
GU Ai-jun;SUN Feng
..............page:31-34,38
Research of Embedded SRAM Build-in Self-test in the SoC
ZHANG Li;LOU Sheng-qin
ZHANG Li;LOU Sheng-qin
..............page:27-30
Reliability Analysis and Design for A STN-LCD Driver
JIANG Hong-li;LIU Ming-feng;RAO Xi-bing;SU Yu-qiu;WU Jin
JIANG Hong-li;LIU Ming-feng;RAO Xi-bing;SU Yu-qiu;WU Jin
..............page:23-26,44
The Key Technologies and Development Directions of SoC
LI Chen;YU Zong-guang
LI Chen;YU Zong-guang
..............page:18-22
Microwave Performance Design of JF04F18 SMD Package
TU Chuan-zheng;CUI Guo-yan;LI Hai-bo
TU Chuan-zheng;CUI Guo-yan;LI Hai-bo
..............page:13-17
..............page:9-12
The Design of A Stacked-die Packaging Using EDA Tools for Simulation
WANG Yan;ZHANG Xiao-lin
WANG Yan;ZHANG Xiao-lin
..............page:5-8,17
PIND Failure Analysis of Air-tightness Ceramic Packaging and the Solutions
GUO Wei;GE Qiu-ling
GUO Wei;GE Qiu-ling
..............page:1-4