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Electronics and Packaging
1681-1070
2007 Issue 10
dian zi yu feng zhuang za zhi zheng gao qi shi
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page:49
guan yu jin xing xian jin dian zi feng zhuang gong yi ji shu yu cai liao pei xun de tong zhi
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page:47-48
xin xi bao dao
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page:7,12,20
Analysis and Research on Leak Rate Equations, Failure Criteria and Internal Gas Concentration (2)
WANG Geng-lin;WANG Li-yan;DONG Li-jun
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page:44-46
Simulation of the Breakdown Voltage of Power Devices
ZHAO Pu-she;WANG Yin-sheng;FU Yi-zhu
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page:40-43
Design of a Low Voltage, Constant Gain, Rail-to-rail Operational Amplifier
GONG Zheng-hui;CHANG Chang-yuan
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page:37-39,43
The Design of Tree Configuration Serial to Parallel Converter
ZHANG Jian-zhong;CHANG Chang-yuan
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page:33-36
8.5GHz~10GHz GaAs Quasi-MMIC Power Amplifier
WANG Yi;LI Fu-xiao;TANG Shi-jun;ZHENG Wei-bin
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page:29-32
The Interface Design and Programming Skill Based on CS2502 LCD Controller
ZHU Gu-huai
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page:25-28
A Broadband CMOS Linear Variable Gain Low Noise Amplifier Design
LI Hai-song;LI Zhi-qun;WANG Zhi-gong
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page:21-24,32
Design of 256-kbit Asynchronous SRAM
PAN Pei-yong;LI Hong-zheng
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page:17-20
DFM of PCB Facing to Electronics Assembly
XIAN Fei
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page:13-16
To Use 6σ to Decrease Badness of PIP Process
MU Shu-xian;SHI Qi-jun
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page:8-12
Cost Analysis Between Solder Bumped Flip Chip and Wire Bonding
YANG Jian-sheng
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page:1-7