1681-1070
2006 Issue 5
..............page:48
..............page:39-47
The Application of Intelligent Control Chip HD7279A
Zhu Hai-jun;Liu Cai-hong;Jing Lan
Zhu Hai-jun;Liu Cai-hong;Jing Lan
..............page:37-39
IC Failtests Technical Study of Particle Impact Noise Detection Testing
Du Ying;Zhang Guo-hua;Zhu Wei-liang;Cai Hong
Du Ying;Zhang Guo-hua;Zhu Wei-liang;Cai Hong
..............page:33-36,39
Design and Analysis of 6～18 GHz MMIC Power Amplifiers Using Cascaded Single Stage Distributed Amplifier Configurations
Cao Hai-yong;Chen Xiao-jian;Qian Feng
Cao Hai-yong;Chen Xiao-jian;Qian Feng
..............page:29-32,4
Analysis of Clock Skew in ASIC Design
Cao Hai-tao;Zheng Jian-hong
Cao Hai-tao;Zheng Jian-hong
..............page:26-28,25
One Kind of CMOS Voltage Reference Using in High Precision A/D
Ji Hui-cai;Zhang Gan-ying
Ji Hui-cai;Zhang Gan-ying
..............page:23-25
A Method of Generating Precision Clock Signal Through Laser Trimming
Zhang Zhao;Wang Ji-an;Li Wei;Wang Na;Zhang Jia;Gong Min
Zhang Zhao;Wang Ji-an;Li Wei;Wang Na;Zhang Jia;Gong Min
..............page:19-22
Testing Serial EEPROM based on Nios Ⅱ
Zhou Ya-li;Zhou Chen;Wu Qian-wen;Zhou Dong-yan
Zhou Ya-li;Zhou Chen;Wu Qian-wen;Zhou Dong-yan
..............page:16-18
The Study of WIP Control System in Semiconductor Assembly and Test Factory
Li Mao;Wang An-lin
Li Mao;Wang An-lin
..............page:12-15,18
Research on Filler Used for Package Resin
Xie Guang-chao
Xie Guang-chao
..............page:9-11
Fabrication and Properties of SiCp/Cu Composites for Electronic Packaging
Chen Guo-qin;Zhu De-zhi;Wu Gao-hui;Zhang Qiang;Xiu Zi-yang
Chen Guo-qin;Zhu De-zhi;Wu Gao-hui;Zhang Qiang;Xiu Zi-yang
..............page:5-8
Recent Developments in Stacked Package
Weng Shou-song
Weng Shou-song
..............page:1-4