Electronics and Packaging 2006 Issue 4 Analysis and Design of a VDD-VSS Clamp Structure in Sub-micron CMOS Circuit

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Electronics and Packaging
1681-1070
2006 Issue 4

..............page:28-32,27

..............page:23-27

MOEMS Devices Technology and Packaging
Luo Yan_heng;Zhang Rui_jun

..............page:18-22,17

..............page:15-17

Development and Problems on Sn-Zn Lead-free Solders
Xiao Ying-ying;Zhou Jian;Xue Feng;Sun Yang-shan;Zhang Wen-dian

..............page:10-14

..............page:6-9

..............page:1-5,14

Study on Switching Converter in Current Mode
Xin Yi-bo;Zhao Shun-dong

..............page:33-35

..............page:36-39,35

..............page:40-42,9

..............page:43-44

xin xi bao dao

..............page:44-48