Electronics and Packaging 2006 Issue 12 Effection of Preheat for EMC

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Electronics and Packaging
1681-1070
2006 Issue 12

Effection of Preheat for EMC
HUANG Dao-sheng;LIU Hong-jun

..............page:11-12,22

Ribbon Wire Bonding Technology
GUO Da-qi

..............page:8-10

Ultrathin Wafer Level Chip Size Package Technology
YANG Jian-sheng

..............page:4-7

The Development of Micro-electronics Packaging Technology and Microminiaturization of Electronic Equipment
HU Xian-jin

..............page:1-3

Research on the Approach of Visual Inspection of Co-Fired Ceramic Substrates Defective
YAN Xue-long;LI Yan

..............page:13-16

The Research Study of Technology in High Density/Big Cavity Ceramic Packaging
XU Yi-fan;LI Zheng-rong

..............page:17-22

Research and Implement of Memory Diagnostic Algorithms
LIU Yan-hua;JING Wei-ping

..............page:23-25,48

Research and Realization of Decoding Strategy for BALISE Telegram Based on FPGA
ZHU Xiao-hang;LI Kai-cheng

..............page:26-30

Research on Hard Decoding Algorithm of LDPC
CAO Jian-lin

..............page:31-33

Asynchronous FIFO Hardware Design Based on FPGA
WANG Hong-chen;LIN Yong-hai

..............page:34-36

The Study of FSG Etching in Non-Stop Layer Dual Damascene Structure
WANG Yi-jing;LIU En-feng;HUANG Jun-wen

..............page:37-41,48