1681-1070
2005 Issue 12
Gold Bump Bonding Process's Application in Domestic Ceramics Packages
Yang Bing;Guo Da-qi
Yang Bing;Guo Da-qi
..............page:10-14,5
Flat Bump Package
Xie Jie-ren
Xie Jie-ren
..............page:6-9
..............page:1-5
..............page:15-19
Some Questions in CQFP Design
Yu Yong-mei
Yu Yong-mei
..............page:20-22
Digital Transistor and Its test
Wu Zhen-jiang
Wu Zhen-jiang
..............page:23-26
..............page:27-31
A New Reference Circuit Based on VT
Li Ding;Cheng Hang
Li Ding;Cheng Hang
..............page:32-34,38
The Design and Analysis for PWM Circuit
Huang Yun-quan;Cai Hong;Liu Ruo-yun
Huang Yun-quan;Cai Hong;Liu Ruo-yun
..............page:35-38
Applications of Infrared Remote Devices Based on Singlechip System
Pei Yah-chun;Chen Zhi-chao
Pei Yah-chun;Chen Zhi-chao
..............page:39-41,9