1681-1070
2005 Issue 11
Experiments on IEEE 1149.4
Li Zheng-guang;Lei Jia
Li Zheng-guang;Lei Jia
..............page:26-30
An Investigation into Heat Dissipation Analysis of the 3D_MCM
Jiang Chang-shun;Xie Kuo-jun;Xu Hai-feng;Zhu Lin
Jiang Chang-shun;Xie Kuo-jun;Xu Hai-feng;Zhu Lin
..............page:21-25
The Lead-free Challenge: Materials for Assembly and Packaging
Yang Jian-sheng
Yang Jian-sheng
..............page:17-20
Microwave Design in Multilayer Ceramic Package
Dai Lei;Fan Zheng-liang;Cheng Kai;Tu Chuan-zheng
Dai Lei;Fan Zheng-liang;Cheng Kai;Tu Chuan-zheng
..............page:13-16
..............page:9-12,25
The Utilities and the Prospect of the Microwave Power Device
Wen Jian;Zeng Jian-ping;Yan Min
Wen Jian;Zeng Jian-ping;Yan Min
..............page:1-8
A Design of 8-bit RISC MCU IP Core
Li Jia-rong;Liu Du-ren;Li Xin-hui
Li Jia-rong;Liu Du-ren;Li Xin-hui
..............page:31-33,30
The Way of Asynchronous Communication between the Synchronous Serial Port of DSP and PC
Xu Yan-feng;Xu Rui
Xu Yan-feng;Xu Rui
..............page:34-35,8
..............page:36-39
..............page:40-42
The Application of PIC16F877 Singlechip in the Earthquake Forecast System
Wang Yi-fei;Zhang Yong
Wang Yi-fei;Zhang Yong
..............page:43-45,42
..............page:39,46-47