Electronics and Packaging 2004 Issue 4 yi ge zhu ti xin ying de feng zhuang ji shu bao gao hui

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Electronics and Packaging
1681-1070
2004 Issue 4

yi ge zhu ti xin ying de feng zhuang ji shu bao gao hui

..............page:64

bi ke yun li shi chang zai hu hui jian mei guo feng zhuang jie ding ji zhuan jia

..............page:64

nanya gong si zeng jia dram sheng chan liang

..............page:12

Technology and Development trend of Si IC
ke zhi jiang

..............page:5-9

Coplanarity Problems of IC Packaging
yang jian sheng

..............page:10-12

The Advanced Chip Package Technology
xian fei

..............page:13-16,4

Flip Chip will be a New Method of Packaging Technology
li xiu qing

..............page:17-19,4

The Integrative Manufacturing of the LTCC Substrate and Its Package
he zhong wei ; wang shou zheng

..............page:20-23

Packaging Structure and Technology of LED
long le

..............page:24-28,32

The Research of a Small Amount AlSiC Packaging Housing of T/R Module
xiong de gan ; liu xi cong ; du yong guo ; yang sheng liang ; li yi min ; tang rong

..............page:29-32

Embedded Flash Memory Cell Designs Technology
feng qing

..............page:33-37,40

36MbSRAM

..............page:9

0.13 m yu 90nm sheng chan gong yi de jin zhan qing kuang

..............page:9

3xin pian die ceng csp cun chu qi

..............page:12

mei guo sealas luo ji gong si zai shen zuo kai she min yong dian zi she ji zhong xin

..............page:12

New IC package, assembly technique by means of a "blind" alignment "flip-chip" method and assembling facilities
Vladimir V.Novikov

..............page:1-4

The Interface Design Between a Virtual Instrument Tester and Handler JS-200
lu jun ; xu de sheng ; zhou ya li

..............page:38-40

The Circuit Design of Data Buffer Based on 386DX
xu meng ; xu zuo ; luo zuo

..............page:41-45

The Design and Implementation of a Low-power Clock Chip
jia yu ran ; ni chun bo ; ying jian hua ; zou xue cheng

..............page:46-49

Analysis and Simulation of Simultaneous Switching Noise for CMOS IC
wang qiang ; mao you de ; wang jing ; zheng jian bin ; chu zuo

..............page:50-53,45

Fully Differential OP-AMP
he zuo ; chen shi jian

..............page:54-56

Introduce A Newer Caller-ID Chip
zhu wei liang ; cao chun xu ; cheng gui

..............page:57-60

A Mathematics Model of development cost of Monolithic Digital IC
gao hong mei ; yu zong guang

..............page:61-64