Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2004 Issue 3
feng zhuang ji shu dong xiang
..............page:27
fpga xin pian gui mo feng zhuang
..............page:23
jia qiang qi ye guan li (-- zhong shi ren de yin su )
han qiang
..............page:63-64
The Lamp of Regylated Brightness of Touching by Controlling of MCU
yang ying ; wei liang zhong ; jiang hui rong
..............page:61-62,53
Hazard and Safety in IC Manufacturing
gu ai jun ; fan qin wen
..............page:54-56,4
The Analysis Method of Failure by Particle Impact
zhu wei liang ; gong jian hua ; lu jian
..............page:51-53
Analysis and Immune for Crosstalk Problem in Sub-micron VLSI Design
chen shou shun ; huang ling yi ; jiang jian hua ; hu wei wu
..............page:48-50,41
High Performance Voltage-to-Frequencey Converter
dong zhen zhong ; liu san qing
..............page:44-47
Cratering and Peeling
ma mian zhi
..............page:42-43,11
Preoxidation of Kovar Alloy for Hermetic Sealing
leng wen bo ; shen zhuo shen
..............page:33-41
BGA Technology and Quality Control
xian fei
..............page:28-32
Analysis and Control of Moisture Content in Microcircuit Manufactured Packages
chen peng ; ou chang yin
..............page:20-23
Taiwan's Microelectronic Technology and Industry
luo hao ping ; cai ju rong
..............page:12-19
Development of Design Methodology and Tools of VLSI
wu xiao jie ; yu zong guang ; tang wei
..............page:5-11
Management Reform and Creation in Knowledge Economy
liu yi ming ; qian feng lin
..............page:1-4