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Electronics and Packaging
1681-1070
2004 Issue 2
shu zi wu xian dian xin ji shu
..............page:44
High Precision Resistor and Capacitor Fabrication Technology
wu xiao zuo ; xu zheng ; he lei
..............page:50-53,5
The Etch of Polysilicon Emitter Bipolar Technology
zheng ruo cheng ; liu li yan ; xu zheng
..............page:47-49,5
Inter-sand Method of Centrifugal Test
gong jian hua ; zhu wei liang ; lv dong ; lu jian ; du ying
..............page:45-46,19
Primary Research on Digital IC Design Cost Model
gao hong mei ; yu zong guang
..............page:41-44
The logic Analysis and Circuit Design of VME Bus Interface Iogic
xie chang sheng ; xu zuo
..............page:34-40
Plastic packaging IC common failure and prevent action
li shuang long
..............page:31-33,40
Parallel Seam Welding
hou zheng jun ; chen yu hua
..............page:27-30
Property and Application of Gold-Tin Solder
liu ze guang ; chen deng quan ; luo xi ming ; xu kun
..............page:24-26,40
The Both Advantages Packaging Tehnology with SOC and SOP
hu zhi yong
..............page:20-23,64
The Technology and Developmant of System in Package
long le
..............page:15-19
Taiwan's Microelectronic Technology and Industry
luo hao ping ; cai ju rong
..............page:6-14
Driving for SMT by advanced Microelectronics Packaging
kuang yan xiang ; zhu song chun
..............page:1-5