1681-1070
2003 Issue 4
..............page:63-64
Warpage of Plastic IC Packages
LI Shuang-long
LI Shuang-long
..............page:24-27
..............page:22-23,46
bga csp he jing yuan ji feng zhuang qian jing ru he ?
chen kun ; wang wen qin
chen kun ; wang wen qin
..............page:20-21
CSP Technology
GUO Da-qi;HUA Cheng
GUO Da-qi;HUA Cheng
..............page:14-19
BGA Packaging Technology
YANG Bing;LIU Ying
YANG Bing;LIU Ying
..............page:6-13,27
..............page:1-5,21
The Application of EDI in Purewater Technique
LIU Xin-qing
LIU Xin-qing
..............page:57-63
WLR--A reliability Test Techniqe Being Widely Used
ZHENG Ruo-cheng;XU Zheng
ZHENG Ruo-cheng;XU Zheng
..............page:52-56
..............page:47-51,64
xin pian chi cun de bian hua dui biao mian an zhuang she bei de ying xiang
li jie ; wang wen qin
li jie ; wang wen qin
..............page:45-46
Real-time Holographic Interferometry in Thermal Deformation of PCB
WANG Wei-ning;GENG Zhao-xin;YUE Wei-wei
WANG Wei-ning;GENG Zhao-xin;YUE Wei-wei
..............page:41-44,31
The Burning-in Test Technique and Method
DU Ying;GUO Da-qi
DU Ying;GUO Da-qi
..............page:36-40,56
..............page:33-35,19
..............page:32,46
ying xiang ping xing feng han cheng pin lv de yin su
chen yu hua ; hou zheng jun
chen yu hua ; hou zheng jun
..............page:28-31