Electronics and Packaging 2003 Issue 1 xin xi bao dao

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Electronics and Packaging
1681-1070
2003 Issue 1

xin xi bao dao

..............page:5,17,25,52,60-64

ad9433 12 wei 105/125msps she pin cai yang a/d zhuan huan qi
an de lie

..............page:58-59

ad9709 8 wei 125msps txdac+(r) shuang tong dao d/a zhuan huan qi
huang zi lun

..............page:56-57

xin de yan jiu jie shi liao yuan jian de que xian mi du
guo shu tian

..............page:53-55,57

dui bo li yu jin shu feng zhuang wai ke qi mi xing de ren shi
han qiang

..............page:49-52

Research for the Effects of the Environmental and Electrostatic Factors on IC Packagings
YANG Een-jiang

..............page:43-48,59

2048 xiang su led ping ban xian shi qi jian de feng zhuang
zhou dong lian ; he zhong wei

..............page:39-42

Elementary Introduction to BGA Multichip Modules and Three-dimentional Packaging Technology(3D)
YANG Jian-sheng

..............page:34-38

Microwave Semiconductor Power Devices and Their Applications
CHENG Wen-fang;SHENG Bai-zhen

..............page:26-33

zhen lie bo dao guang zha fu yong / jie fu yong qi xin ji shu
zhang rui jun

..............page:22-25

na mi dian zi / guang dian zi qi jian gai shu
cheng kai fu

..............page:18-21,13

gao mi du feng zhuang
zuo yu hua

..............page:14-17

qian shuo ban dao ti feng zhuang cai liao
yu zhuang

..............page:10-13

guo nei wai ji cheng dian lu feng zhuang chan ye ping shu
long le

..............page:6-9

21 shi ji zhong guo : shi jie ic feng zhuang ye zhong xin
xie en huan

..............page:1-5

juan shou ji yu

..............page:插页11