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Electronics and Packaging
1681-1070
2001 Issue 2
xin xi bao dao
..............page:49,3,62,5
ths5641a 8 wei 100msps comms dactmd/a zhuan huan qi
huang zi lun
..............page:63-64
duo gong neng mi ni xing chang fang she bei
yu yan ling ; li xiang
..............page:60-62
re men tong xin ji shu :rf wu xian he guang xue
shen zhi ming ; luo si
..............page:56-59
ri jian xing qi de gui san wei ji shu
fu shi ping
..............page:54
bao xing hua san wei feng zhuang
ni qiong dan
..............page:53
jing pian ji feng zhuang huo de fa zhan dong li
tian hui juan
..............page:50-52
The New Trend of Microelectronics Packaging Technology
LI Xiu-qing
..............page:6-10
gao pin yin zhi dian lu ji ban cai liao
yang bang chao ; cui hong ling ; hu yong da ; jiang ming
..............page:11-16
feng zhuang qiang ti nei zi you li zi de kong zhi
ding rong zuo
..............page:24-26
Technology Review: Wafer-level Packaging
FU Zheng-wei
..............page:27-29
sui pian de gong yi kong zhi yan jiu
zhang wen
..............page:35-36
you liang de dan guan cun chu (flash memory) dan yuan
du zhi hua
..............page:37-39
yong feng zhuang mo kuai ti dai soc de tan tao
zhang guo hua ; zhang guang yuan
..............page:40-45
shi jie shang mi du zui gao de mcm ji shu
jing wei ping ; shi zuo jun
..............page:46-49