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Electronic Product Reliability and Environmental Testing
1672-5468
2015 Issue 5
Reliability Prediction Model of Engineering IGBT Module
YU Di;,SHI Dian-yang;,REN Yan;,YU Zhao-jie;
..............page:6-10
Study on the Influence of the Deformation of Solder Layer on the Resistance of IGBT
WANG Yan-feng;,ZHANG Xiao-ling;,SHE Shuo-jie;,TIAN Yun-jie;
..............page:20-23
SpaceWire System Chip Testing Technology
WANG Xiao-qiang;,SUN Yu;
..............page:24-27
The Application of Solid State Relay in Weapon System
DU Guang-yuan;
..............page:28-31
Discussion on Thermal Design Method of Electronic Products
Zhu Jia-wei;,XIE Jiang;,ZHANG Ze;,LI Qian;,GAO Jun;
..............page:47-50
tou gao xu zhi
..............page:后插1