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Electronic Product Reliability and Environmental Testing
1672-5468
2015 Issue 4
Failure Mechanism and Reliability Assessment of the Copper Wire Bonding Plastic Package Device
HE Sheng-zong;,XUE Yang;,WU Hui-wei;,LIU Li-yuan;
..............page:9-13
Failure Analysis of Immobility of Electromagnetic Relay after Power up
WANG Zhi-bin;,CHEN Yan;,ZHANG Wei;
..............page:14-17
xin xi dong tai
..............page:17,21,31,45,49,54,59,65,68-69,后插1-后插2
Failure Analysis Case of the Seperation of Ag-Pd Electrode
QIAN Yu-jing;,YOU Hong-xu;,LOU Qian;
..............page:18-21
Research on Quality Metric of Wearable Devices
LI Yun-ting;,ZHANG Fan;,YANG Chun-hui;,YANG Dong-yu;
..............page:22-24
An Anti-Plug Method of Web Game Based on User Data Analysis
YANG Dan;,GAO Yuan;,GU Xin;,ZHANG Bao-lin;,HU Pei-chang;
..............page:25-31
Research on Security Level Testing and Evaluation Model of Operating System
ZHANG Zhi-qiang;,HUANG Xiao-kun;
..............page:32-37
Data Procesing Method for a Step-stress Accelerated Degradation Test
SHEN Zheng-rong;,GAO Jun;
..............page:46-49
Comprehensive Evaluation Scheme for the Storage Life of Equipment
LI Kai;,GAO Jun;,LI Xiao-bing;,HUANG Dao-ping;
..............page:50-54
Quality Control Method for the Test Program of Large Scale Integrated Circuit
SUN Yu;,TANG Rui;,WANG Xiao-qiang;
..............page:55-59
Sealing Detection Method for Electrical Connector
ZHOU Shuai;,NIU Fu-lin;,LU Si-jia;,LIU Lei;,WANG Bin;
..............page:60-65