Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronic Product Reliability and Environmental Testing
1672-5468
2015 Issue 2
A Study and Commentary on NASA Electronic Parts and Packaging Hermeticity Task Overview
WANG Geng-lin;,LI Ning-bo;,DONG Li-jun;,LI Fei;
..............page:6-13
xin xi dong tai
..............page:13,72-73,后插1
Tailor Method Research of ESS Test Condition on Modules-level Electronic Products
BEI Guang-chang;,LI Lou-de;,HUANG Ze-gui;
..............page:14-18
Improvement Study on Decapsulation Method for Cu-wire Bonding Plastic Package Device
HE Sheng-zong;,WU Hui-wei;,WANG You-liang;
..............page:35-38
Stress Induced Electromigration Failure Analysis
CHEN Xuan-long;,SHI Gao-ming;,CAI Wei;,KUANG Xian-jun;
..............page:39-43
Test Methods for Evaluation of LTCC Manufacturing Process
DONG Zuodian;,WEN Ping;,YANG Zhao;,HUA Xi;
..............page:44-47
The Sensitivity Analysis of the Irradiation Effect of DDS
lu xiang jun ;, wang xiao zuo ;, luo hong wei ;, wang xiao qiang ;, fei wu xiong ;, sun yu ;, lv hong feng ;, liu zuo ;
..............page:48-51
The Improvement of Quality Control and Organizational Structure in Project
LIANG Jian-dong;,QU Jie;,HUANG Ze-gui;
..............page:52-56
The Exploration of Enhancing the Design Audit
YU Jin;
..............page:57-59
Satellite Navigation RF IC Testing Technology on the Basis of ATE
WANG Xiao-qiang;,LUO Hong-wei;
..............page:64-66
Embedded Training Teaching Support Technology and Its Application
YU Xue-min;,SONG Wei;,LI Xin;
..............page:67-72