1672-5468
2013 Issue 6
Discussion on Condensed System Reliability Test
DING Ding-hao;
DING Ding-hao;
..............page:1-4
..............page:4,31,35,44,54,59,67,后插1-后插4,封3
Removing Absorbed Helium Testing and its Related Standards
LI Fei;,LI Ning-bo;,LIU Yong-min;,WANG Geng-lin;
LI Fei;,LI Ning-bo;,LIU Yong-min;,WANG Geng-lin;
..............page:5-12
Effects of CMOS Digital IC on Middle Level
LI Xing-hong;,LIANG Yun;,LIN Jian-jing;,ZHAO Chun-rong;,ZHAO Jun-ping;
LI Xing-hong;,LIANG Yun;,LIN Jian-jing;,ZHAO Chun-rong;,ZHAO Jun-ping;
..............page:13-16
Study on Radiation of Different Types of Bipolar Transistor
GUAN Tong-tong;,JIA Xu-guang;,WANG Peng-peng;,XIE Xue-song;,ZHANG Xiao-ling;
GUAN Tong-tong;,JIA Xu-guang;,WANG Peng-peng;,XIE Xue-song;,ZHANG Xiao-ling;
..............page:17-20
..............page:21-23
New Method of Determining the Weighting Factor in the Reliability Assessment
CHE Jian-guo;,GUO Yi-ru;,WANG Zong-shuai;
CHE Jian-guo;,GUO Yi-ru;,WANG Zong-shuai;
..............page:24-27
Design of Reliability Growth Demonstration Statiscs Plan
KANG Rui;,WANG Wen-yu;,WEI Chuan;
KANG Rui;,WANG Wen-yu;,WEI Chuan;
..............page:28-31
..............page:32-35
GaAs MMIC Heat Generation Mechanism and Thermal Modeling for Junction Temperatures
EN Yun-fei;,HE Xiao-qi;,LAI Ping;,ZHAO Lei;,ZHOU Bin;
EN Yun-fei;,HE Xiao-qi;,LAI Ping;,ZHAO Lei;,ZHOU Bin;
..............page:36-40
Testability Simulation Analysis of Integrated Avionic System
HUANG He;,ZHANG Yi;,ZHANG Yu-jing;
HUANG He;,ZHANG Yi;,ZHANG Yu-jing;
..............page:41-44
Study of Calibration for 1～18 GHz Electronic Field Probe
LIANG Qiong-chong;,WANG Shi;
LIANG Qiong-chong;,WANG Shi;
..............page:45-49
Design and Analysis of Vibration Fixture for Suspended Electric Equipment in EMUs
CHEN Biao;,LIU Guo-tao;,WANG Peng;,YU Feng;
CHEN Biao;,LIU Guo-tao;,WANG Peng;,YU Feng;
..............page:50-54
Reliability Analysis of Metal Al-PCB Substrate
CHENG Gang;,SUN Jie;
CHENG Gang;,SUN Jie;
..............page:55-59
..............page:60-63
Design of Environmental Adaptability and Use of Large Electronic Products for Tropical Ocean
LIU Dan;
LIU Dan;
..............page:64-67