Electronic Product Reliability and Environmental Testing 2006 Issue 4 Design of Programmable Logic Parts

Home | Survey | Payment| Talks & Presentations | Job Opportunities

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Electronic Product Reliability and Environmental Testing
1672-5468
2006 Issue 4

Design of Programmable Logic Parts
CAI Song-ping;ZHANG Xi-hong;LU Fan

..............page:71-74

Failure Mode of OCXO Diagnosis
ZOU Jin-lin;LI Shao-ping

..............page:19-22

Failure Causes Analysis due to Heat Stress of Bipolar Microwave Power Transistor
LI Ping;LAI Ping;ZHENG Ting-gui

..............page:16-18

Application of SEM to Destructive Physical Analysis of Electronic Components
XU Ai-bin;SHI Ming-zhe

..............page:14-15

Hot Carrier Degradation Mechanisms in SOI MOSFETs
ZHANG Xiao-wen;EN Yun-fei;ZHAO Wen-bing;LI Hen

..............page:9-13

Evaluation Technique for Long-term Storage Life of Electronic Components and Devices Caused by Single Failure Mechanism
LIU Jian;EN Yun-fei;HUANG Yun;YANG Dan

..............page:23-25

Oxide-trap and Interface-trap Charge Separation Analysis Techniques on MOSFET
HE Yu-juan;SHI Qian;LI Bin;LUO Hong-wei;LIN Li

..............page:26-29

Enviromental Stress Screen of Airborne Electronics
SONG Hong-bo

..............page:30-33

Environmentad Suitability Analysis of Airborne Electronics
LIN Lin

..............page:34-37

Research on the ESS of Electronic Products
YANG Fang-yan;LIU Jun;LIN Zhen

..............page:38-40

The Analysis of BugScam Automatization Static Vulnerability Inspection
QU Ye;ZHANG Hao

..............page:41-45

Reliability Evaluation Based on Bayes Performance Degradation Model
ZHANG Yong-qiang;LIU Qi;ZHOU Jing-lun

..............page:46-49

Statistical Analysis of Cyclic Progressive Stress Accelerated Life Testing
SHEN Zui-yi

..............page:50-52

Risk and Countermeasure for Application of Plastic Packaged Microcircuit into High-reliability Field
LAI Ping;EN Yun-fei;NIU Fu-lin

..............page:53-58

Reliability and Anti-interference Technology of Embedded System Software
WU Wei-jie

..............page:59-64

Application of Digital Thermo/Humidity Sensor with Calibration Coefficients
HUANG Jun-hui;HUANG Yu-fei;RONG Xian-zhen

..............page:65-70

Discussion on the Problem of Electronic Products Reliability Testing
FAN Jian-zu

..............page:1-3

Corrosive Failure Cases Analysis of PCB with Parts of Au-plating for Mobile Telephone
ZHU Li-qun;DU Yan-bing;LI Wei-ping;LIU Hui-cong

..............page:4-8