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Electronic Product Reliability and Environmental Testing
1672-5468
2006 Issue 1
xin kan tui jie
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page:64
"dian zi yuan jian " xiang guan biao zhun ( wu )
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page:59
pc xin pian zu shi chang zeng chang shi tou qiang jin
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page:41
wo guo shou tao zi zhu shu zi shi pin guang bo xi tong " wen shi "
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page:34
xin yi dai " shi chuang " cao zuo xi tong ji jiang wen shi
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page:27
2006,3g shou ji lai liao
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page:22
chang jian de fei fa ding ji liang dan wei yu fa ding ji liang dan wei de huan suan guan xi ( yi )
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page:18
iso 17025 jian jie
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page:5
Classification of Aircraft System and its Function
GAO Jun;CHEN Tao;KUANG Zhi-li
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page:60-64
Organizational Management for Supervision of Large Complex Information Engineering Project
NI Qing-sui
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page:56-59
CommucationBilling Solution in SGIP Extended Protocol
LI Che
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page:35-37
Analysis of Quick Researching and Manufacturing System Based on Serial Network
SHI Xian-ming;GUO Bo;LIANG Liang
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page:32-34
Simulation and Analysis of the Ultrasonic Doppler System Used in Medical Treatment Based on SystemView
HUA Jian-hao;LE Zi-chun;LIU Guo-yue
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page:28-31
Design for Security Based on WinNT DACL
YANG Zong-chang
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page:23-27
Design for Fault Tolerance with Double Servers
WU Jian-feng;JING Wen-fang
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page:19-22
Determination and Qualification of Reliability Indexes for Communication Equipment
ZENG Li-wei;LU Chuan
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page:15-18
Inferences for the BS Life Model from Accelerated Degradation Tests
ZHAO Jian-yin;SUN Quan;PENG Bao-hua;ZHOU Jing-lun
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page:11-14
Analysis of Reliability Indicators of Radar Net
LIU Xiang;LIANG You-ming;Guo Yi-zhong;YUAN Jin-dong
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page:9-10
Reliability Evaluation for Residual Life of Assemblies On-board Helicopter
ZHANG Hong-bin;WANG Jin-cai
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page:6-8
The Research of Reliability Indexes of Communication Network
PAN Yong
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page:1-5
Reliability Growth of Mobile Radar Based on FMECA
GAO Hong-xing;LI Jian
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page:52-55
Problem and Method Concerning Reliability Estimation
ZHANG Sheng-yan
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page:49-51
Reliability Prediction of a System Software Based on NHPP Model
LIU Yang;JIANG Liang
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page:46-48
RIE and the Application in the VLSI Failure Analysis Field
LIN Xiao-ling;FEI Qing-yu;ZHANG Xiao-wen;SHI Ming-zhe
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page:42-45
Gold-Aluminum Bonding Reliability in Thermal Shock Environment
YAN Qin-yun;ZHOU Ji-cheng;YANG Dan;HUANG Yun
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page:38-41