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Electronic Product Reliability and Environmental Testing
1672-5468
2005 Issue 5
zheng gao qi shi
..............page:74
tou gao xu zhi
..............page:75
suo yue biao
..............page:76
ding yue dan
..............page:76
ben qi dao du
..............page:77
Research on spares in storage of products
LI Jiu-xiang;LIU Chun-he;ZHANG Shi-nian
..............page:1-6
Application of BP neural network on the prediction of non-operation reliability of electronic
HUANG Rui-yi;YANG Shao-hua;LI Kun-Lan;WU Fu-gen
..............page:7-9
Research on the application of reliability statistic testing
ZHANG Yuan-min;XIN Yun
..............page:14-17
Environmental stress screening overview and new approach
LIU Hang-seng
..............page:18-20
Effects of MOS device dimension on radiation response
LIU Yuan;EN Yun-fei;LI bin;SHI Qian
..............page:21-24
Analysis of thermal stress of Au bonding thread in CSP
XIE Jing-song;ZHONG Jia-qi;YANG Bang-chao;JIANG Ming
..............page:68-71
The compilation of software testing documents
WANG Hong
..............page:63-67
Design of the network classroom based on campus net
LI Yong-ke;TIAN Qing-min;LI Jian-zen
..............page:56-59
An efficient frame skipping strategy in rate control scheme
CAI Wen-xia;DU Ming-hui
..............page:52-55
Some views on ESD protection strategy
XU Jin-hua;LIU Guang-bin;YU Zhi-yong
..............page:47-51
Design of for heat sinks electronic products
LI Xiao-song
..............page:30-33
Application of reverse engineering technology
ZHANG Hong-jin
..............page:25-29