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Electronic Product Reliability and Environmental Testing
1672-5468
2005 Issue 2
PCB design techniques for EMC
HUANG Sheng-lin;JIANG Hai-xun
..............page:39-42
rohs zhuan ti ( er )
..............page:彩插
The analysis of a TT&C radar's reliability growth test
LIU Yang;YANG Yi-fei
..............page:8-11
The method of reliability numerical simulation and its application
YUAN Li-feng;WANG Jun
..............page:17-20
Forecasting the storage life of military electronic part by the grey system GM (1, 1) model
YANG Shao-hua;WU Fu-gen;HUANG Rui-yi;LI Kun-lan
..............page:21-24
PCB coating gold layer compactness analysis
LI Shao-Ping
..............page:25-27
Corrosive failure of PCB and its failure analysis
XU Ai-bin;ZHENG Ting-gui
..............page:28-30
Quality and reliability of solder joint
LI Zhi-ming
..............page:31-34
Analysis of SnPb solder joint strain and stress in flip-chip
LI Chuan;ZHONG Jia-qi;JING Xing-jiu;XIE Jing-song
..............page:35-38
wu sun jian ce jian jie
..............page:72
emc shu yu ( san )
..............page:68
shi me shi " bang ding "
..............page:24
neng xiao biao zhi
..............page:7
Quality control technique in electronic components purchase
NIU Fu-lin;SONG Fang-fang
..............page:73-77
The research status of environmental factor in reliability assessment
ZHAO Wan;WEN Yu-quan
..............page:69-72
Security control of campus network
Yu Hua-fang;ZHANG Wen-Hao
..............page:65-68
Submit package extension of SGIP extended protocol
LI Che;LI Ji-yun;SU Yuan-sen
..............page:61-64
ODA software verification
SU Peng-yi;CHEN Kai-sheng;CAO Zhuang-qi
..............page:53-56
Anti-interference design of PCB
XIAO Lin-fen
..............page:43-46