Electronic Product Reliability and Environmental Testing 2003 Issue 5 A New Method for Reliability Evaluation of Device--Construction Analysis(CA)

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Electronic Product Reliability and Environmental Testing
1672-5468
2003 Issue 5

A New Method for Reliability Evaluation of Device--Construction Analysis(CA)
zhang yan wei ; jiang li dong ; chen zhi qiang

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BS Model for Degradation Failure of Electronic Product
zhong zheng ; sun quan ; zhou wei

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Discussion about Temperature Condition of Soak Test
wu dong hai ; wang xing bin

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Study on Optimized Design of Silicon Acceleration Sensor Chip
deng yong he ; li yu zuo ; xu mai chang

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Analysis for Reliability of Industry Computer Parts
hu xiao yu ; he hua yun ; tang chao fan

..............page:37-41

Application of FMEA for the CDMA Repeater
wang san hong ; ru hong tao

..............page:34-36

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The Technique for High and Low Temperature Testing of VLSI
jiao hui fang ; jia xin zhang

..............page:26-28

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Study on Lifetime Distribution and Degradation Law of The Thick-film Resistors in MCM-C
zhou zhong rong ; guo chun sheng ; cheng yao hai ; li zhi guo ; zou qiong ; zhang zeng zhao ; mo yu zuo

..............page:15-19