1672-5468
2002 Issue 1
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..............page:38
..............page:67-67
Research for Flip - Chip BGA Technology to Avoid Cracking
yang jian sheng ; xu yuan bin ; li hong
yang jian sheng ; xu yuan bin ; li hong
..............page:62-66
Reliability Growth of Airborne Equipment In- Service
tian kai rang
tian kai rang
..............page:58-61
Optimization of Filtration Method
di song zhen
di song zhen
..............page:54-57
..............page:49-53
Quality Problem Aided Material
luo dao jun
luo dao jun
..............page:45-48
..............page:39-44
Thermal Reliability Design for PCB
sheng jian you
sheng jian you
..............page:34-38
..............page:30-33
..............page:27-29
Verification and Application of Silicon
su peng yi
su peng yi
..............page:23-26
The Failure Mechanism of Zebra Paper Connection Resistance Becoming Rise and Improvement Effect
li shao ping ; zhang xiao ming ; luo dao jun ; wang shi ping ; wang qin
li shao ping ; zhang xiao ming ; luo dao jun ; wang shi ping ; wang qin
..............page:18-22
The Effect of Hot Carrier Degradation on the MOS Devices
zhang xiao wen ; zhang xiao ming
zhang xiao wen ; zhang xiao ming
..............page:14-17
Location of the Self- Oscillation on a Microwave Amplifier
lai ping ; zheng ting gui
lai ping ; zheng ting gui
..............page:9-13
New Failure Analysis Technology for Microelectronics Packaging--Double Transmission SAM
he xiao zuo ; ma zuo ; gu guan hua
he xiao zuo ; ma zuo ; gu guan hua
..............page:5-8
TDDB Test and Parameter Extraction of Gate Oxides
en yun fei ; kong xue dong ; xu zheng ; zhao wen bin
en yun fei ; kong xue dong ; xu zheng ; zhao wen bin
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