1004-227X
2016 Issue 1
Study on Cu/NiW/Sn interface transition in copper pillar bumping
WU Jie-fei;,LI Chao;,LI Ming;
WU Jie-fei;,LI Chao;,LI Ming;
..............page:1-5
Effects of process conditions on current efficiency of crack-free hard chrome electroplating with flexible extrusion
WANG Shu-zhen;,ZHU Zeng-wei;,CHEN Bin;,QU Ning-song;
WANG Shu-zhen;,ZHU Zeng-wei;,CHEN Bin;,QU Ning-song;
..............page:6-9
Electro-brush plating of nickel-tungsten-cobalt-nano silicon carbide composite coating and its properties
CHEN Da-chuan;,XIE Guang-rong;,ZENG Peng;,LI Cheng-fei;,XU Xiao-dong;
CHEN Da-chuan;,XIE Guang-rong;,ZENG Peng;,LI Cheng-fei;,XU Xiao-dong;
..............page:10-13
Effect of brightening agent on properties of medium-phosphorus nickel coating deposited by acidic electroless plating
YANG Qian-yun;,ZHENG Wen-zhi;,ZHANG Xiao-ming;,LU Xuan;,LIN Ji-yue;,CHEN Yao;,YU Xin-wei;
YANG Qian-yun;,ZHENG Wen-zhi;,ZHANG Xiao-ming;,LU Xuan;,LIN Ji-yue;,CHEN Yao;,YU Xin-wei;
..............page:14-18
Effects of process parameters on efficiency of tin dissolution in tin plating system using insoluble anode
HE Dan;,QIN Zong-hui;,SUN Yue-qing;,TANG Wei;,WANG Qing;
HE Dan;,QIN Zong-hui;,SUN Yue-qing;,TANG Wei;,WANG Qing;
..............page:19-22
Effect of magnetic abrasive finishing on surface quality of Inconel718 alloy
CHEN Chun-zeng;,ZHANG Gui-xiang;,ZHAO Yu-gang;
CHEN Chun-zeng;,ZHANG Gui-xiang;,ZHAO Yu-gang;
..............page:23-27
Preparation and properties of niobium-manganese composite electrode material
SUN Ya-ru;,ZHANG Wei-wei;,LI Hai-quan;
SUN Ya-ru;,ZHANG Wei-wei;,LI Hai-quan;
..............page:28-32
Selection of sealant for two-step anodic oxidation of aluminum alloy used for mobile phone shell
HUANG Jian-zhang;
HUANG Jian-zhang;
..............page:33-36
Grey evaluation on safety management of small- and micro-sized electroplating enterprise park based on WSR theory:a case study on Zhenjiang Environment-friendly Plating Professional Area
CHENG Yu-he;,ZHOU Han-qing;,LIU Hong;
CHENG Yu-he;,ZHOU Han-qing;,LIU Hong;
..............page:37-43
On thick silver electroplating in thiosulfate bath
QIN Quan-sheng;
QIN Quan-sheng;
..............page:44-45
..............page:46-50
..............page:51