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Electroplating & Finishing
1004-227X
2014 Issue 8
Electrochemical behavior of white copper-tin electrodeposited in pyrophosphate aqueous electrolyte
GUO Yan;,LI Shu-quan;,XIE Jin-ping;,ZENG Zhen-ou;,ZHAO Yang;
..............page:317-320
Effect of S-carboxyethylisothiuronium betaine on electroless nickel plating
CAO Quan-gen;,CHEN Shi-rong;,LUO Xiao-hu;,WANG Hao;,YANG Qiong;
..............page:321-324
Effect of a novel surfactant on performance of chemical-mechanical polishing solution used for copper with low abrasive content
FAN Shi-yan;,LI Hong-bo;,LI Yan;,LIU Yu-ling;,TANG Ji-ying;,YAN Chen-qi;,ZHANG Jin;
..............page:325-329
xing ye xue xi zi liao tui jie
..............page:329-329
Study on mathematical model for simulating the corrosion rate of micro-arc oxidation coating on magnesium alloy
CHEN Ling-ling;,FENG Long-long;,GU Yan-hong;,LI Si-rui;,LI Yan;
..............page:330-334
Preparation of nickel-cobalt/silicon carbide composite coating by high-frequency pulse plating
LIU Xue-wu;,QU Yi;,SUN Li-long;,XU Yun-hua;
..............page:335-337
Optimization of electroless copper plating on diamond particles
JIANG Yang;,SHEN Wen-hao;,TONG Guo-qing;,YANG Wei-feng;,ZHONG Hong-hai;
..............page:338-342
shu xun
..............page:342-342
Anodizing process of aluminum guide roller
GUO Chen-xiang;
..............page:343-345
Study on reduction of heavy metal emission in electroplating industry based on substance flow analysis
CHEN Tong-sheng;,LIU Wei-min;,SUN Qiang;,WANG Tao;,YANG Jing;
..............page:346-349
zhong guo zhuan li xin xi
..............page:359-360
dian du yu tu shi za zhi ban yue kan gai ban gong gao
dian du yu tu shi bian ji bu ;
..............page:361-361