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Electroplating & Finishing
1004-227X
2014 Issue 20
Electrochemical behavior of thulium(Ⅲ) on copper electrode in dimethylformamide
HUANG Yan;,LU Jun;,WANG Jian-chao;,ZHAO Mei-feng;
..............page:859-862
Electroforming of titanium diboride-reinforced copper matrix composite material
BI Fang-qi;,DAI Chun-shuang;,LI Li;,WU Ya-zhou;,ZHU Cui-wen;
..............page:863-866
Influence of carboxyl complexant on nickel-phosphorous alloy plating
HANG Dong-liang;,HANG Kang;,HE Chun-lin;,YANG Bin-bin;,YU Li-hua;,ZHOU Qi;
..............page:867-869
Study on heat treatment and wear performance of electroless Ni-P alloy deposit
cao huan ;, cui xiang hong ;, hua hua ping ;, li xin xing ;, liu jia qiang ;, luo hong li ;, wang shu qi ;, xie qiang qiang ;
..............page:870-873
Chrome-free pretreatment on surface of finished aluminum ahoy wheel
A La-teng;,DENG Yun;,WANG Zai-de;,ZHANG Wei;
..............page:878-881,后插1
Analysis and treatment for peeling off problem of gold electroplating coating
CHENG Ying-xing;,FU Ming;,WANG Xi-yi;,XIONG Jun-liang;
..............page:889-890
xin xi dong tai
..............page:901-904