Electroplating & Finishing 2008 Issue 3 Calendar of Events

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Electroplating & Finishing
1004-227X
2008 Issue 3

Calendar of Events

..............page:68-72

zheng ce fa gui / shi chang zong heng / xin xi ji zuo

..............page:66-67

zhong guo zhuan li xin xi

..............page:62-65

Lastest Patents

..............page:61

Paint & Coatings Industry News

..............page:60

Establishment of a computer system for color matching of latexes
CHEN Ming-yi;CHEN Bing-yao;CHEN Bing-qiang

..............page:56-59

Oxidation resistant coating technology applied to steel billet in high temperature dynamic process
WEI Lian-qi;YE Shu-feng;SUN Wei-hua;LIU Rui-bin;CHEN Yun-fa

..............page:53-55

Anti-corrosion coating quality control of the concrete structure in tideland
LI Yun-de;ZHANG Guang-zhi;YANG Zhen-bo

..............page:50-52

Application of airless spraying machine to steel structure coating-pan one
LI Min-feng

..............page:46-49

Study on liquid polybutadiene cathodic electrophoretic coatings
QIN Shu-chao;WANG Jin-wei;HE Ye-dong;LI Xiao-gang;LI Bing-xia

..............page:43-45

da du zhe wen ( san )
yuan shi zuo

..............page:41-42

Analysis on pollution links in PCB process and cleaner production-part one
ZHANG Zhong-yi

..............page:36-40

Analysis of the components of acid chemical coloring solutions for stainless steel
GONG Shan-hua;XUE Yong-qiang;LUAN Chun-hui

..............page:33-35,40

Study on environmental protection type surface treatment technology of electrolytic Copper foil
YANG Xiang-kui;HU Xu-ri;ZHENG Xiao-Wei

..............page:29-32

Effect of ac pore-enlarging on electrolytic coloring of anodized aluminum film
WANG Hua;TAO Wei;ZHANG Dou;ZHOU Hai-hui;KUANG Ya-fei

..............page:25-28

Trivalent chrome passivation process using in the hot-dip galvanizing of insulator hardware fittings
MIAO Li-xian;LIU Yan-jun;MIAO Ying;WU Tao;CHEN Jing;HOU Zhi-Jiao

..............page:22-24

Study on lead-and cadmium-free composite additive for electroless nickel plating
LIU Hai-ping;LI Ning;BI Si-fu;ZHANG Dong

..............page:19-21,24

Review on alternatives to nickel plating and nickel saving technicses
YUAN Shi-pu

..............page:15-18

Analysis of common problems in alkaline tin plating on copper foil
CHEN Wei-jian

..............page:13-14

Novel process for plating antique tin
L(U) Jing-chun

..............page:12-12

Cyanide-free electroplating process of copper-fin alloy with high tin content
LIU Jian-ping

..............page:9-11

Practice of non-cyanide alkaline copper plating process
XU Jin-lai;DENG Zheng-ping;ZHAO Guo-peng;HU Yao-hong;ZHANG Xiao-ming

..............page:7-8

Potential activation phenomenon and non-cyanide direct copper plating
FENG Shao-bin;HU Fang-hong

..............page:4-6,11

Applications of electrochemical impedance spectroscopy to the research of electrodeposition-Part Ⅲ
YUAN Guo-wei

..............page:1-3