1001-3849
2014 Issue 7
Synthesis and Photoelectrochemical Properties of CdSe Nanowires by Constant Potential Deposition Method
LU Jing;,WANG Hong-zhi;,YAO Su-wei;,ZHANG Wei-guo;
LU Jing;,WANG Hong-zhi;,YAO Su-wei;,ZHANG Wei-guo;
..............page:1-6
Study on the Flame and Smoke Suppression Performance of Zinc Borate Intumescent Fire Retardant Coating
GU Xiao-yu;,HU Zhong-wu;,LI Hong-fei;,LI Zhi-shi;,SONG Xiao-hui;,WANG Hua-jin;,ZHANG Sheng;
GU Xiao-yu;,HU Zhong-wu;,LI Hong-fei;,LI Zhi-shi;,SONG Xiao-hui;,WANG Hua-jin;,ZHANG Sheng;
..............page:7-11
..............page:11,后插1-后插3
Effects of Temperature and Current Density on Coating Microscopic Morphology in Cyanide-free Silver Plating
ZHAO Jian-wei;
ZHAO Jian-wei;
..............page:12-15,19
Electro-polishing of Ni-5％W Substrate for Coated Conductor
HAN Jie;,PENG Dong-hui;,WU Xiang-yang;,XU Jing-an;,ZHU Hai;
HAN Jie;,PENG Dong-hui;,WU Xiang-yang;,XU Jing-an;,ZHU Hai;
..............page:16-19
Reseach Status of Electroplated Nickel-based Alloy Coating
FENG Chang-jie;,HU Shui-lian;,OU-YANG Xiao-qin;,WAN Ying;,YU Bin;,ZHANG Bin-bin;,ZHOU Lin-yan;
FENG Chang-jie;,HU Shui-lian;,OU-YANG Xiao-qin;,WAN Ying;,YU Bin;,ZHANG Bin-bin;,ZHOU Lin-yan;
..............page:20-24,29
..............page:25-29
Improving the Coating Thickness Uniformity of Lead Frame Plating by Using Shielding Board Compensation Effect Properly
SUN De-yi;,WANG Jin-sheng;,YE De-hong;,ZHANG Xue-lei;
SUN De-yi;,WANG Jin-sheng;,YE De-hong;,ZHANG Xue-lei;
..............page:30-32,36
..............page:33-36
Optimization of Chemical Mechanical Polishing Process of Copper Film
FAN Shi-yan;,LI Hong-bo;,LI Yan;,LIU Yu-ling;,TANG Ji-ying;,YAN Chen-qi;,ZHANG Jin;
FAN Shi-yan;,LI Hong-bo;,LI Yan;,LIU Yu-ling;,TANG Ji-ying;,YAN Chen-qi;,ZHANG Jin;
..............page:37-41
Comprehensive Treatment Scheme for Complicated Electroplating Wastewater
JIN Hui;,LIU Jin-you;,LV Hai-feng;,ZENG Meng;
JIN Hui;,LIU Jin-you;,LV Hai-feng;,ZENG Meng;
..............page:42-46