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Plating & Finishing
1001-3849
2013 Issue 6
Influence Factors of TiO2 Nanopore Thin Films Prepared by Electrochemical Method
LI Fei-hui;GONG Yun-lan;LI Chuang;LI Ming-hui;ZHANG Dan-dan;ZHANG Hong-qing
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page:1-3
Application of Electroplating Technology in Electronic Products
WANG Hao;HAO Jian-jun;AN Cheng-qiang;LIN Xue
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page:39-44
xin xi dong tai
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page:后插4
Research Advances of Surface Treatment for Magnesium Alloys
WANG Ming;SHAO Zhong-cai;TONG Shuai
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page:10-15
Corrosion Resistance of Ni60 Coatings Prepared on Aluminum Bronze Surface by Flame Remelting
HAN Fu-hui;CHANG Xia;ZHANG Xiao-bin;HUANG Wei-jiu
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page:4-6,15
Application and Research Progress of Electroless Silver Plating in Composite Powders
LI Wen-liang;ZHAO Qi-jin;FANG Zheng-qiu
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page:16-20,25
Influences of Pigments and Fillers on Performance of Phenol Aldehyde Epoxy Resin Coating
FANG Kun;MA Yu-ran;LI Yi-xuan;XIONG Jin-ping
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page:26-29,38
Technologies and Performances of Silver-coated Copper Powder Prepared by Displacement Reaction
SONG Yue-hai;MA Li-jie
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page:7-9
Determination of Potassium Permanganate Content in Oxidized Solution by Iodometry Method
JIN Huan;XU Xiao-ping
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page:45-46
Technics of Electroless Ni Plating on Carbon Fiber Surface
LOU Wei-dong;TONG Xin-sheng;WANG Shao-feng
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page:30-34
Studies on the Performances of Pb-Ag-SiC Anode during Zn Electrowinning
ZHANG Yong-chun;CHEN Bu-ming;GUO Zhong-cheng;LIU Jian-hua
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page:35-38
The Application of Sequential Plating in HDD Head Wafer Fabrication
WANG Ji-kang;WANG Yong-kang
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page:21-25