1001-3849
2012 Issue 10
Research Status of Refractory Metal Directly Prepared by Refractory Metal Oxide
LIU Ya-bin;LI Yun-gang;ZHANG Kuai;ZHANG Dong-qing;HUANG Yong-zhi;ZHANG Fu-dong
LIU Ya-bin;LI Yun-gang;ZHANG Kuai;ZHANG Dong-qing;HUANG Yong-zhi;ZHANG Fu-dong
..............page:14-19
..............page:42-43
Determination of Micro-copper and Micro-manganese in Water by Spectrophotometric Method
CHEN Hai-chun
CHEN Hai-chun
..............page:39-41
Studies on Treatment of Electroplating Wastewater Containing Cu2 + by Water Quenching Slag
ZHANG Zun-ju;LI Guo-hui;DONG Ya-rong
ZHANG Zun-ju;LI Guo-hui;DONG Ya-rong
..............page:44-46
Pd-free Electroless Copper Plating on PET Films Modified by Photografting Acrylic Acid
PAN Zhan-chang;ZHANG Hui-chong;WU Shou-kun;LI Zhu-liang;DENG Jian-feng;HU Guang-hui;XIAO Chu-min
PAN Zhan-chang;ZHANG Hui-chong;WU Shou-kun;LI Zhu-liang;DENG Jian-feng;HU Guang-hui;XIAO Chu-min
..............page:6-9
Recent Status and Development of Composite Electrodeposition from Trivalent Chromium Bath
HOU Feng-yan;HU Hui-li;TU Zhen-mi
HOU Feng-yan;HU Hui-li;TU Zhen-mi
..............page:10-13,19
Effects of Na2B4O7·10H2O on Characteristics of MAO Coatings Fabricated on AZ91D Magnesium Alloy
XIA Yong-ping;WANG Shu-yan;LIU Li
XIA Yong-ping;WANG Shu-yan;LIU Li
..............page:1-5
Applications of Electrochemical Technology in the Microelectronics Industry( Ⅰ ) (to be continued)
LUO Chi;QIN Ling
LUO Chi;QIN Ling
..............page:20-22
Electroless Nickel Plating on Diamond Particles
REN Chun-chun;LIN Guo-xing;MEI Tian-qing
REN Chun-chun;LIN Guo-xing;MEI Tian-qing
..............page:35-38
Causation and Improvement of Having No Copper in the Blind Hole of Printed Circuit Board
CHEN Shi-jin;LUO Xu;QIN Xin;QIAO Peng-cheng
CHEN Shi-jin;LUO Xu;QIN Xin;QIAO Peng-cheng
..............page:23-26,34
Electrocatalytic Oxidation of 4-CP by PbO2 Anode
ZHOU Tao;YAO Ying-wu;DU Peng
ZHOU Tao;YAO Ying-wu;DU Peng
..............page:32-34
..............page:29-31
..............page:27-28