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Journal of Materials Engineering
1001-4381
2010 Issue 10
Microstructure of FeCrAl Alloy Vacuum Brazing with Ni82CrSiB Filler Metal
GAO Yong;XIA Zhi-dong;CUI Ying-ya
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page:57-60
Laser Welding of TiNi Shape Memory Alloy Using Pure Cu as Interlayer
LI Hong-mei;SUN Da-qian;WANG Wen-quan;HAN Yao-wu;DONG Peng
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page:9-12,26
The Microstructure and Mechanical Property of the ZrB2-based Ultra-high-temperature Ceramic Composites Joints
LI Zhuo-ran;WANG Zheng-zheng;WU Guang-dong;ZHU Xiao-zhi
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page:73-76
Investigations on Melting Property, Wettability and Mechanical Property of Sn-XAg-0.5Cu Lead-free Solder Alloys
WEI Guo-qiang;WAN Zhong-hua;ZHAO Si-yong;ZHANG Yu-peng;LIU Feng-mei
..............
page:53-56
Diffusion Bonding of Titanium Alloy and Superalloy at Lower Temperature Using the Ti and Ni Thin Films as Interlayer
ZHOU Yuan;LI Xiao-hong;MAO Wei;BI Xiao-fang;XIONG Hua-ping;WU Xin
..............
page:96-99
Research of Intermetallic Compounds at Interface of Sn2.5Ag0.7CuxRE Solder Joints During Aging
ZHANG Ke-ke;HAN Li-juan;WANG Yao-li;ZHANG Xin;ZHU Yao-min
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page:18-21,37
Microstructure and Strength of Cf/SiC Joints with Ag-Cu-Ti Brazing Fillers
CHEN Bo;XIONG Hua-ping;CHENG Yao-yong;MAO Wei;YE Lei;LI Xiao-hong
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page:27-31
Microstructures of TiAl Joints Brazed with CoFe-based and Fe-based High-temperature Filler Metals
YE Lei;XIONG Hua-ping;CHEN Bo;MAO Wei;CHENG Yao-yong;LI Xiao-hong
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page:61-64,68
Microstructure and Mechanical Properties of the Welding-brazed Joint for the Aluminium and Galvanized Steel Sheet
LI Yu-long;JIANG Zhi-chao;YU Ye-xiao
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page:82-85
Filling and Wetting Behaviors of Liquid Filler Metal in the Process of Ultrasonic Soldering of Aluminum Alloy
XU Zhi-wu;YAN Jiu-chun;ZHONG Li;YANG Shi-qin
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page:1-4,8
Growth Kinetic of Intermetallic Compounds and Failure Behavior for SnAgCu/Cu Solder Joints Subjected to Thermal Cycling
XIAO Hui;LI Xiao-yan;LI Feng-hui
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page:38-42
Effect of Alloy Element on Microstructure and Impact Toughness of Sn-57Bi Lead-free Solders
HE Peng;LU Xiao-chun;ZHANG Bin-bin;MA Xin;QIAN Yi-yu
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page:13-17,31
Transient Liquid Phase Diffusion Bonding of DD32 Single Crystal Superalloy
LANG Bo;HOU Jin-bao;WU Song
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page:32-37
Study on Properties of Low-silver Lead-free Solder Alloys with Alloy Element Doping
ZHANG Yu-peng;WAN Zhong-hua;XU Lei;LIU Feng-mei;YANG Kai-zhen
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page:100-104
Preparation and Properties of Nano-YSZ Thermal Spraying Powders
HUANG Wei;ZHU Ying;HE Jing;WANG Rui-jun
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page:86-88,95
Reaction Mechanism of Ni-Cr/Ti/Porcelain Interface
LIU Jie;QIU Xiao-ming;WANG Hong-ying;SUN Da-qian;YAO Han-wei;HAN Xiu-hong
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page:43-47
Brazing of Superalloy GH586 with Nickel-base Filler Metals
LI Tian-wen;GUO Wan-lin;HUAI Jun-feng
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page:48-52
Development of a Semi-solid Zn-Al Alloy Filler Metal with Globular Grains
SHI Lei;YAN Jiu-chun;HAN Yan-fei;PENG Bo
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page:65-68
Study on the Sintering Characteristics and Application in Cu Bulk Bonding of Ag-nanoparticle Paste
YAN Jian-feng;ZOU Gui-sheng;LI Jian;WU Ai-ping
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page:5-8
Effect of Brazing Clearance on the Vacuum Brazed Joint Microstructure of 316L Stainless Steel
YU Zhi-shui;SHI Kun;YAN Zhi;LI Jun;LI Rui-feng
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page:77-81
Effect of Ag Addition on the Properties of Sn-1.5Zn Based Alloys for Soldering Aluminum
LIU Liang-qi;XU Jin-hua;CHEN Sheng;MA Xin;ZHANG Xin-ping
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page:22-26
Study the Evaporating Controlled of Near Surface Element in TLP Diffusing Bonded
LI Jing;HOU Jin-bao;WU Song
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page:69-72
Effect of Solidification Mode on Microstructure and Properties of Sn-Bi Solders
LU Xiao-chun;HE Peng;ZHANG Bin-bin;MA Xin;QIAN Yi-yu
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page:89-95