1006-883X
2010 Issue 11
The mold breakout prediction system based on thermocouple
HE Tao-tao;TIAN Lu;LI Feng-guo;LIU Qiong;LIU Xiao-ling;WANG Shi-xiong
HE Tao-tao;TIAN Lu;LI Feng-guo;LIU Qiong;LIU Xiao-ling;WANG Shi-xiong
..............page:29-32
The thermoelectric-potential determining system of E-type thermocouple based on MCU
QI Xue-hong;LV Cheng-li
QI Xue-hong;LV Cheng-li
..............page:19-21,18
Smart materials and smart structures(3)-Design, controlling and detection of smart structures
SHI Yong-ji;CAO Hui-min;LIU Gang-tian;YE Fang
SHI Yong-ji;CAO Hui-min;LIU Gang-tian;YE Fang
..............page:6-12
Design of remote base station information retrieval system based on embedded ARM_linux
GUAN Xiang-hong;HAN Yan;YAO Jin-jie
GUAN Xiang-hong;HAN Yan;YAO Jin-jie
..............page:22-24,28
Optimization of electronic nose and its application in the classification of vinegar
WANG Xiao-liang;LIU Hai-yan
WANG Xiao-liang;LIU Hai-yan
..............page:13-15
Pressure compensation design of ultrasonic flow measurement
LI Jing;GUO Hong-mi
LI Jing;GUO Hong-mi
..............page:16-18
Shock wave test system based on Zigbee wireless sensor networks
YU Kai-kai;DU Hong-mian;MA Tie-hua
YU Kai-kai;DU Hong-mian;MA Tie-hua
..............page:25-28