Electrical properties of 70Ge:Ga near the metal–insulator transition
M Errai;A El kaaouachi;H El idrissi;Laboratoire MSTI;Ecole Supérieure de tecchnologie d’Agadir;B.P: 33/S University Ibn Zohr;Faculty of Sciences;Agadir;Morocco;Laboratoire Electronique;électrotechnique;Automatique et Traitement de l’Information;Département Génie Electrique;Faculté des Sciences et Techniques de Mohammedia;Université Hassan II Mohammedia Casablanca;BP 146 Quartier Yasmina;Mohammedia;
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Effects of a carbon implant on thermal stability of Ni0.95(Pt0.05)Si
Feng Shuai;Zhao Lichuan;Zhang Qingzhu;Yang Pengpeng;Tang Zhaoyun;Yan Jiang;Wu Cinan;Key Laboratory of Microelectronics Devices & Integrated Technology;Institute of Microelectronics;Chinese Academy of Sciences;College of Big Data and Information Engineering;Guizhou University;
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Thermal simulation of flexible LED package enhanced with copper pillars
Liu Yang;Stanley Y.Y.Leung;Cell K.Y.Wong;Cadmus A.Yuan;Zhang Guoqi;Sun Fenglian;School of Material Science and Engineering;Harbin University of Science and Technology;Beijing Research Centre;Delft University of Technology;State Key Laboratory of Solid State Lighting;Institute of Semiconductors;Chinese Academy of Sciences;DIMES Center for SSL Technologies;Delft University of Technology;
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Benzotriazole removal on post-Cu CMP cleaning
Tang Jiying;Liu Yuling;Sun Ming;Fan Shiyan;and Li Yan;Institute of Microelectronics;Hebei University of Technology;Electrical Engineering Department;Tianjin Metallurgical Vocation-Technology Institute;
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