..............page:118-121
Investigation of an a-Si/c-Si interface on a c-Si(P) substrate by simulation
Wang Jianqiang~+;Gao Hua;Zhang Jian~1;Meng Fanying~2; and Ye Qinghao 1 Shanghai ChaoRi Solar Energy Science & Technology Co.;Ltd;Shanghai 201406;China 2 Shanghai Institute of Microsystem and Information Technology;Chinese Academy of Sciences;Shanghai 200050;China 3 Department of Physics;Shanghai Jiao Tong University;Shanghai 200240;China
..............page:8-14
A 1.2-V CMOS front-end for LTE direct conversion SAW-less receiver
Wang Riyan~1;Huang Jiwei~;Li Zhengping~1; Zhang Weifeng~1;and Zeng Longyue~1 1 Guangzhou Runxin Information Technology Co.Ltd;Guangzhou 510663;China 2 College of Physics and Information Engineering;Fuzhou University;Fuzhou 350002;China 3 Institute of RF- & OE IC;Southeast University;Nanjing 210096;China
..............page:76-80
..............page:101-108
Robust and low power register file in 65 nm technology
Zhang Xingxing~1;Li Yi~1;Xiong Baoyu~1;Han Jun~1; Zhang Yuejun~2;Dong Fangyuan~1;Zhang Zhang~3; YuZhiyi~;Han Jun~1;Cheng Xu~1; and Zeng Xiaoyang~1 1 State Key Laboratory of ASIC and System;Fudan University;Shanghai 201203;China 2 Institute of Circuits and Systems;Ningbo University;Ningbo 315211;China 3 School of Electronic Science and Applied Physics;Hefei University of Technology;Hefei 230009;China
..............page:109-113
..............page:94-100
Metal gate etch-back planarization technology
Meng Lingkuan~+;Yin Huaxiang~+;Chen Dapeng and Ye Tianchun Key Laboratory of Microelectronics Devices of Integrated Technology;Institute of Microelectronics;Chinese Academy of Sciences;Beijing 100029;China
..............page:114-117
Properties of a Ni-FUSI gate formed by the EBV method and one-step RTA
Zhang Youwei~;Xu Dawei~2;Wan Li~1;Wang Zhongjian~2; Xia Chao~2;Cheng Xinhong~2;and Yu Yuehui~2 1 Department of Physics;Wenzhou University;Wenzhou 325035;China 2 State Key Laboratory of Functional Materials for Informatics;Shanghai Institute of Microsystem & Information Technology; Chinese Academy of Sciences;Shanghai 200050;China
..............page:122-124