China Adhesives 2010 Issue 2 s01-7 ju an zuo qing qi zhong bi ma you chun suan shu zhi de zuo zhi ce ding

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

China Adhesives
1004-2849
2010 Issue 2

..............page:64

xin xi

..............page:7,21,32,44,53

huan bao ren zao ban yong zuo quan shu zhi jiao zhan ji
bai ming fang ; gao zhen ; wang ling ling

..............page:63-64

..............page:27-29

Study on water-based laminating adhesives for plastic/plastic lamination
li sheng hua ; jiang yun gang ; feng xiao ping ; deng kang qing ; wang ling ling

..............page:42-44

..............page:30-32

Influence of cold plasma treatment on bonding performance of wood
wang hong yan ; wang hui ; du guan ben ; lei hong

..............page:13-16

Study on epoxy resin curing systems used for wind power blades
zhao wei chao ; ning rong chang ; guo yan qiang

..............page:1-3

..............page:45-48

Study on WPU emulsion modified by EP
zhao wen tao ; zheng shui rong ; zhang cong li

..............page:38-41

zhuan li jie shao

..............page:61-62

Study on waterborne polyurethane modified by acrylate based on short chain fluoride
zhou wei yan ; chen hong mei ; zhou tao ; liang hong wen ; zhang ai min

..............page:22-26

Research progress of cyanate ester resin
zhao qing xin ; kou kai chang ; bi hui ; zuo min ; wang zhi chao

..............page:49-53

Study on synthesis of a sucrose-p-cresol resin adhesive optimized by response surface methodology
du zuo ; gao yan ; wang wen jing ; li yu long ; zhao qiong ; chen shuan hu

..............page:8-12

..............page:17-21

Study on application of UV-curable modified epoxy resin adhesives With speed bonding
ma xiao wang ; chen zuo chi ; zhu li qun ; hu wei ; wang xin zhou

..............page:33-37

Research progress of conductive adhesive in micro-electronic encapsulation
duan guo chen ; qi shu hua ; wu xin ming ; qi hai yuan

..............page:54-60

..............page:4-7