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China Adhesives
1004-2849
2004 Issue 6
ye ti dan xing huan yang shu zhi
..............page:48
zhuan li jie shao
..............page:63
su ju he wu zhan he ji
..............page:36
xin xing huan yang zhan he ji
..............page:36
mu cai jiao zhan ji
..............page:21
Present situation and trend of polyurethane adhesive in our country
lu dong zhen ; sun jie
..............page:37-42
Study on the production of UV-curing epoxy acrylic coating
chen yuan wu
..............page:33-36
Development of the sealant with IIR-1751 butyl rubber
chen min zhu
..............page:28-29
Study on decorative SBS adhesive
liang hong wen ; kang zuo ; zhang zhi bin ; yuan zuo yan ; zhang jian guo ; tian xue da
..............page:25-27
Effects of catalyst on the bonding processing property of polyurethane adhesive
liu yi jun ; fu wen yan ; sun lin
..............page:22-24
Study on polyurethane adhesive for shoes
zhan zhong xian ; zhu chang chun
..............page:18-21
Preparation of conducting static emulsion adhesive
hu xiao yong ; zhang xin ya ; lan ren hua ; chen huan qin
..............page:1-4
Preparation and application of water-based metal-wood compound adhesive
ai zhao quan ; zhou qi long ; liao shui zuo ; wang yan
..............page:5-7
Preparation of environmental protection composite adhesive
gan meng zuo ; liu juan
..............page:8-10
Study on application performance of structural bonding tape
wang guo jie ; ma wen shi ; pan hui ming
..............page:11-13
xin xing tao ci zhuan zhan jie ji
..............page:13
xin xing ding ben jiao
..............page:10
zi jiao lian fu he jiao zhan ji
..............page:10
Application and trend of chlorinated polypropylene in adhesive
tang feng ; fu he qing ; chen huan qin
..............page:57-59
Research present conditions of friendly-environment wood adhesive
wu zi qiang ; zeng xian ce
..............page:53-56
Study progress in water-resistance of polyvinyl acetate emulsion
sun wen bing ; wang shi min ; xu zu xun ; dong bing hai
..............page:49-52
Progress in conductive adhesives for microelectronic interconnection
xiao jiu mei ; huang ji hua
..............page:43-48