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Printed Circuit Information
1009-0096
2016 Issue 3
New situation, new thoughts, snew development
liang zhi li ;
..............page:1
Rapid prototyping process research of flexible electronic circuits based on 3D printing technology
GAO Yu-le;,SHI Chang-chun;,DONG De-chao;,Chen-rong;,Shan-bin;
..............page:5-8,23
A new method to manufacture FCCL
LIN Fu-qiang;
..............page:9-15
Analysis and improvement of the solder joint failure in selective ENIG PCB
LIU Chang-chun;,GAO Tuan-fen;,WANG Jing-hua;
..............page:16-19
Study on hole wall pits in hole metallization of PCB
BAI Hui-bin;,XUN Rui-ping;,LIU Bai-lan;,AO Si-chao;,ZHONG Yu-ling;
..............page:20-23
Research of inner micro short by black foreign inclusion in PCB
ZHANG Dong;
..............page:24-26,49
Research of Poor Plug Hole PCB BGA Lack of Nickelage during ENIG Process
HAN Qi-long;,LIU Ke-gan;
..............page:27-29
Research the Countermeasures of OSP Surface Treatment Problems
HAN Yan-lin;,BAI Hui-bin;,ZHANG Xing-wang;,HUANG Li;
..............page:30-33,56
Cause and solution of PCB burst
SONG QIANG;,PAN Qiu-ping;
..............page:34-37
The study of electroplating super thick gold technology in PCB manufacture
TAO Shan-mou;,QI Zhen-jia;,ZHANG Wen-han;
..............page:42-44
The studies a new type without cyanide silver plating process
SHUAI He-ping;
..............page:45-49
Study on dewetting problem of ENIG boards
ZHANG Yi-bin;,XUN Rui-ping;,LIU Bai-lan;,AO Si-chao;,ZHONG Yu-ling;
..............page:50-51,60
Chemical laboratory management theory of PCB field
LIU Zhong-dan;,GAO Tuan-fen;
..............page:57-60
Management by objectives in factory
XU Zhao-chen;
..............page:61-62
A case of how to control protracted default
XI Kai-li;
..............page:63,68
Improvement of unhealthy factors of OSP
ZHANG Hua-di;,YANG Xue-zhi;
..............page:64-68
The analysis for high resistance in the hole of PCB
LI Yan;
..............page:69-70
xin xi dong tai
..............page:71-72