1009-0096
2016 Issue 11
..............page:1-1
..............page:5-8
The introduction of CPCA standard of"the silver paste through hole printed circuit board"
YU Jun-rong;
YU Jun-rong;
..............page:9-12
The introduction of CPCA standard"Metal base Copper Clad Laminate for printed circuits"
LIU Shen-xing;
LIU Shen-xing;
..............page:13-14,66
Brief introduction of general specification of carbide drills for printed boards (revised edition)
GUO Qiang;,XIAO Zhen-jian;
GUO Qiang;,XIAO Zhen-jian;
..............page:15-17,44
..............page:18-20,63
Introduction to organic ceramic-base Copper Clad Laminate standard
QIN Zhen-zhong;,SONG Cui-ping;
QIN Zhen-zhong;,SONG Cui-ping;
..............page:21-23
..............page:23-23
Glass film in the practical application of the 25 μm fine lines
LIU Xin-hua;,LIU Fang-yuan;,DUAN Shao-hua;,WANG Jun;,ZENG Ping;
LIU Xin-hua;,LIU Fang-yuan;,DUAN Shao-hua;,WANG Jun;,ZENG Ping;
..............page:24-27
Research of PCB expansion compensation factor control by mathematical metrology model
XU Qi-lin;,XIE Ming;,CAI Yue-yang;,TAO Kun;
XU Qi-lin;,XIE Ming;,CAI Yue-yang;,TAO Kun;
..............page:28-31
Application of improvement in wet film rate on the line of good
WANG Ping;,QI Hai-bo;,HE Yan-qiu;,ZHANG Yong-mou;,SHI Shi-kun;
WANG Ping;,QI Hai-bo;,HE Yan-qiu;,ZHANG Yong-mou;,SHI Shi-kun;
..............page:32-35
Study on influence of alkaline etching solution by NaOH
LIU Song-yan;,WU Qing-qing;
LIU Song-yan;,WU Qing-qing;
..............page:36-38
Research on the application of statistical hypothesis testing in the process of PCB experiment
WANG Yu-zhou;,LIU De-wei;
WANG Yu-zhou;,LIU De-wei;
..............page:39-44
Development of polyimide composite film for FCCL
SHE Nai-dong;
SHE Nai-dong;
..............page:45-49
mian lin yuan cai liao jin que he ti sheng pcb qi ye ru he ying dui -- zhuan fang zhu hai fang zheng yin shua dian lu ban fa zhan you xian gong si zong cai hu yong shuan
mao wen zuo ;, li long zhen ;
mao wen zuo ;, li long zhen ;
..............page:49-49
Research on protection method of exposed inner pad of FPC multilayer board
ZOU Pan;,WU Wei-zhong;,LI Tonglin;,WANG Jun;,ZENG Ping;
ZOU Pan;,WU Wei-zhong;,LI Tonglin;,WANG Jun;,ZENG Ping;
..............page:50-53
The application of various surface treatment technology on FPCB
LIU Fa-da;,LI Meng-long;,KE Yong;
LIU Fa-da;,LI Meng-long;,KE Yong;
..............page:54-57
..............page:58-63
An alternative to aluminum plug hole method
WANG Zhao;
WANG Zhao;
..............page:64-66
Analysis on the failure of PCB to CAF test
CHEN Zhi-xin;
CHEN Zhi-xin;
..............page:67-70
..............page:70-70
New Product & New Technology (113)
gong yong lin ;
gong yong lin ;
..............page:71-71
Technology & Abstract (177)
gong yong lin ;
gong yong lin ;
..............page:72-72