1009-0096
2016 Issue 10
te qi zhi sheng
gong yong lin ;
gong yong lin ;
..............page:1-1
Super computer high-speed backplane production technology
SONG Jian-yuan;,PENG Wei-hong;,LIU Dong;,ZHANG Pan-pan;
SONG Jian-yuan;,PENG Wei-hong;,LIU Dong;,ZHANG Pan-pan;
..............page:5-11
Study of printed circuit board manufacture process with ultra-thick basal plate
CHANG Xuan-wei;,LUO Xu;
CHANG Xuan-wei;,LUO Xu;
..............page:12-16
Process technology for double side and multi-layer PCB with aluminum plate
XIA Guo-wei;,WANG Zhen;,LI Jia-yu;,HUANG Hui;,TONG Fu-sheng;
XIA Guo-wei;,WANG Zhen;,LI Jia-yu;,HUANG Hui;,TONG Fu-sheng;
..............page:17-21
The highly efifcient production method of full-scale PCB
HUANG Yong;,FU Lei;
HUANG Yong;,FU Lei;
..............page:22-27
Necessity analysis of constituting multi-layer co-ifred ceramic process standards
CHAO Yu-qing;,CAO Kun;,XIA Qing-shui;
CHAO Yu-qing;,CAO Kun;,XIA Qing-shui;
..............page:28-32
Several quality control approaches to zero-defect of the PCB process production
LIU Song-lun;,WANG Heng-yi;
LIU Song-lun;,WANG Heng-yi;
..............page:33-35,63
Introduction to PCB line bad factors on the PCB pattern transfer process
JING Zhan-wei;,HAN Yong-xin;
JING Zhan-wei;,HAN Yong-xin;
..............page:36-38,42
Study on the PCB surface treatment of heavy tin off oil anomaly
ZHU Shi-feng;,ZHU Shi-hua;
ZHU Shi-feng;,ZHU Shi-hua;
..............page:39-42
Analysis of delamination of dense Dissipate heat via area in PCB based on DOE
ZHANG Hua-yong;,YANG Chang-feng;,DAI Yong;,XUN Rui-ping;
ZHANG Hua-yong;,YANG Chang-feng;,DAI Yong;,XUN Rui-ping;
..............page:43-46
The main points of speciifcation for printed electronics functional conductive materials
GONG Yong-lin;
GONG Yong-lin;
..............page:47-50,70
Calixarence is bonding reagent of printed circuit boards
zhang wei ;, liu zhen quan ;, zuo tong fang ;, wu pei chang ;
zhang wei ;, liu zhen quan ;, zuo tong fang ;, wu pei chang ;
..............page:51-59
..............page:60-60
The efifcacies of additive RS-859 in etchant which is made from sulfuric acid/hydrogen peroxide solution
WU Tong-fang;
WU Tong-fang;
..............page:61-63
Enhance the bond strength of R-FPCB
ZHANG Chuan-chao;,HE Zi-li;,ZENG Ping;,WANG Jun;
ZHANG Chuan-chao;,HE Zi-li;,ZENG Ping;,WANG Jun;
..............page:64-66
The improvement of LED splicing screen PCB warping
WANG Xiao-bin;,LI Xiao-hai;,YE Han-Xiong;,ZHOU Xing-mian;
WANG Xiao-bin;,LI Xiao-hai;,YE Han-Xiong;,ZHOU Xing-mian;
..............page:67-70
New Product & New Technology (112)
gong yong lin ;
gong yong lin ;
..............page:71-71
Technology & Abstract (176)
gong yong lin ;
gong yong lin ;
..............page:72-72