1009-0096
2015 Issue 9
..............page:0-0
..............page:5-9
..............page:9-9
Preparation and application properties of photoresist
ZHOU Hu;,LI Ning;,JIANG Min;,LUO Xiao-yang;,TANG Jia-lin;,QIN Xian-zhi;
ZHOU Hu;,LI Ning;,JIANG Min;,LUO Xiao-yang;,TANG Jia-lin;,QIN Xian-zhi;
..............page:10-13
The production technology of fine bonding pad in optical communication module PCB
ZHAI Qing-xia;,ZHAO Bo;,ZHU Tuo;
ZHAI Qing-xia;,ZHAO Bo;,ZHU Tuo;
..............page:14-17,37
Study on the resist on PCB via hole
XU Zhao-chen;
XU Zhao-chen;
..............page:18-22,56
Research and improvement on the flexible board damage in rigid-flex PCB laser lid removing
LIN Qi-heng;,WEI Xiong;,LIN Ying-sheng;,CHEN Chen;
LIN Qi-heng;,WEI Xiong;,LIN Ying-sheng;,CHEN Chen;
..............page:23-27
Study on reliability of laser blind hole in the flexible dielectric material
LIN Chu-tao;,MO Xin-man;,CHEN Bei;
LIN Chu-tao;,MO Xin-man;,CHEN Bei;
..............page:28-31
Analysis of deformation on flexible board in lamination process
ZHU Tuo;,KUANG Xu-ping;,HE Miao;,QUE Yu-long;
ZHU Tuo;,KUANG Xu-ping;,HE Miao;,QUE Yu-long;
..............page:32-37
Production technology of 36 layer asymmetric structure of thick copper PCB
WANG Zuo;,ZHU Tuo;,LI Jin-long;
WANG Zuo;,ZHU Tuo;,LI Jin-long;
..............page:38-43
The development review of the optical interconnecting backplanes
LIU Qiu-hua;,WU Xiao-long;,FANG Qing-ling;
LIU Qiu-hua;,WU Xiao-long;,FANG Qing-ling;
..............page:44-45,60
..............page:46-50
The development and application of SIP technology
CHEN Yue;,ZHOU Xiao-yu;,JI Xiu-xia;
CHEN Yue;,ZHOU Xiao-yu;,JI Xiu-xia;
..............page:51-53
Delamination drilling technology for probe plate of test fixture
CHEN Cui-juan;,YANG Huan;,FU Xian-hui;
CHEN Cui-juan;,YANG Huan;,FU Xian-hui;
..............page:54-56
Research on the design for central system of oil cooling
GONG Ping;,HUANG Hong;
GONG Ping;,HUANG Hong;
..............page:57-60
..............page:61-65
zheng wen tong zhi
ben kan bian ji bu ;
ben kan bian ji bu ;
..............page:65-65
Discussion on the process improvement of the PCB half hole process
ZHANG Shuang-lin;,CHONG Gao-liang;
ZHANG Shuang-lin;,CHONG Gao-liang;
..............page:66-68
..............page:68-68
New Product & New Technology (99)
gong yong lin ;
gong yong lin ;
..............page:69-69
Technology & Abstract (163)
gong yong lin ;
gong yong lin ;
..............page:70-70
..............page:71-72