1009-0096
2012 Issue 8
..............page:17-20
The ultrasonic cleaning application in PCB production
ZHANG Geng-sheng
ZHANG Geng-sheng
..............page:21-23,67
..............page:24-25
The study on PCB via hole plugging
CHEN Yong-Jun;YANG Si-Jing;LIANG Ying
CHEN Yong-Jun;YANG Si-Jing;LIANG Ying
..............page:26-29
A study to the fabrication process of PCB used in SFP optical module
AN Guo-yi;YAN Lai-liang;LI Chang-sheng;WEN Ze-sheng
AN Guo-yi;YAN Lai-liang;LI Chang-sheng;WEN Ze-sheng
..............page:30-33,54
Heat-resisting reliability research of the laminated buried coin board
LV Hong-gang;REN Rao-ru;CHEN Ye-quan;JI Cheng-guang
LV Hong-gang;REN Rao-ru;CHEN Ye-quan;JI Cheng-guang
..............page:34-39
..............page:40-46
Research of reliability and gold thickness control in flash gold PCB
ZENG Hong;YANG Shao-bo;HU Xi
ZENG Hong;YANG Shao-bo;HU Xi
..............page:47-54
..............page:55-61
Zero nickel waste water discharge process study
HUANG Kun-ping
HUANG Kun-ping
..............page:62-67
The application of the seamless bonding endmill in PCB manufacturing
DAI Yong;YUAN Guo-dong;CAO Cou-xian
DAI Yong;YUAN Guo-dong;CAO Cou-xian
..............page:68-70
..............page:71-72,后插1-后插2
..............page:3-4
..............page:5-6
..............page:7-10,20
Study on the technology of high resin Prepreg used in the thin core & thick copper foil PCB structure
MA Dong-jie;ZHENG Jun;WU Xiao-xian
MA Dong-jie;ZHENG Jun;WU Xiao-xian
..............page:11-12,25
Film lamination defect improvement
LIAO Chang-xin
LIAO Chang-xin
..............page:13-16,61