Printed Circuit Information 2011 Issue 2 xin xi dong tai

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Printed Circuit Information
1009-0096
2011 Issue 2

xin xi dong tai

..............page:71-72

White reflection material and ceramics packaging technology for LED

..............page:12-17,32

Advance control of exterior angle precision on FPC
LI Qing-bao

..............page:47-51

Newly trend and prospect of electronic packaging technology

..............page:66-70

Awareness of product quality applications in the enterprise
YE Jing-min;YE Ming

..............page:55-56

The effect of static and prevention method in TDR test processing
HUANG Rong-qiong

..............page:43-46,54

Selection and association of agents in the electronic cloth treatment
HUANG Chang-gen

..............page:28-32

The enterprise must have the \'three-products\'
LIN Jin-du

..............page:5-5,27

SNIT programming based on mobile phone PCB product
PENG Zhong-quan;LIU Zhen

..............page:61-65

Survey and guide: accelearte Meizhou PCB improvement

..............page:3-4

Analysis and improvement on delamination issue of HDI automobile board
DENG Wen-zhang

..............page:52-54

The practice of CAD-E based on project teaching reform
CHEN Li-de;YAN Rui-rui

..............page:18-20

Chip scale packaging based on flexible printed circuit
CHEN Bing

..............page:57-60

Increasing of heat dissipation substrate market is driving the development of PCB industry
ZHU Datong

..............page:6-11

SiP coordination design and PI analysis(1)

..............page:35-42

Study on gold-peeling of electronics nickel immersion gold
HU Yan-hui;LIU Liang-ping;XIE Hai-shan;ZHANG Yu-meng

..............page:33-34,42

Status and development trend of automotive electronics and its requirements on PCB(1)
WANG Wei-tai

..............page:21-27