Microstructures and Properties of SnAgCu Solder Doped with Eu
Zhang Liang;Tu King Ning;Guo Yonghuan;He Chengwen;Mechanical and Electrical Engineering Institute;Jiangsu Normal University;Provincial Key Laboratory of Advanced Welding;Jiangsu University of Science and Technology;Department of Materials Science and Engineering;University of California;Los Angeles CA90024;USA;
..............page:11-15
Morphology of Nanophase WC/6Co Composite Powder Prepared by Spray Conversion Method
Guo Shengda;Yang Jiangao;Lü Jian;Zhu Ertao;Chen Hao;Zhang Xuehui;Engineering Research Institute;Jiangxi University of Science and Technology;Engineering Research Center of Tungsten Resources High-Efficiency Development and Application Technology of the Ministry of Education;Advanced Corporation for Materials & Equipment;Powder Metellurgy & Special Materials Research Department;General Research Institute for Nonferrous Metals;
..............page:43-48
Progress in Ti-Based Shape Memory Alloys
Xue Pengfei;Zhang Fei;Li Yan;Zhang Deyuan;School of Materials Science and Engineering;Beihang University;Key Laboratory of Aerospace Advanced Materials and Performance;Ministry of Education;Lifetech Scientific Corporation;
..............page:84-90